HD64F3048BF25 Renesas Electronics America, HD64F3048BF25 Datasheet - Page 895

IC H8 MCU FLASH 128K 100QFP

HD64F3048BF25

Manufacturer Part Number
HD64F3048BF25
Description
IC H8 MCU FLASH 128K 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3048BF25

Core Processor
H8/300H
Core Size
16-Bit
Speed
8MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Reset in T3 State
Figure D.3 is a timing diagram for the case in which RES goes low during the T3 state of an
external memory access cycle. As soon as RES goes low, all ports are initialized to the input state.
AS, RD, HWR, and LWR go high, and the data bus goes to the high-impedance state. The address
bus outputs are held during the T3 state.The same timing applies when a reset occurs in the T2
state of an access cycle to a two-state-access area.
RES
Internal
reset signal
Address bus
CS
CS
AS
RD (read access)
HWR, LWR
(write access)
Data bus
(write access)
I/O port
0
7
to CS
Figure D.3 Reset during Memory Access (Reset during T3 State)
1
Access to external address
T1
T2
Rev. 3.00 Sep 27, 2006 page 867 of 872
T3
Appendix D Pin States
High-impedance
High-impedance
High-impedance
H'000000
REJ09B0325-0300

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