PIC24FJ16MC102-I/SP Microchip Technology, PIC24FJ16MC102-I/SP Datasheet - Page 17

• Manufacturer Part Number: PIC24FJ16MC102-I/SP
• Description: 16-bit Motor Control Family, 16 MIPS, 16KB Flash, 1KB RAM 28 SPDIP .300in TUBE
• Manufacturer: Microchip Technology
• Series: PIC® 24Fr

Specifications of PIC24FJ16MC102-I/SP

• Featured Product: PIC24FJ/33FJ MCUs & dsPIC® DSCs
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 16 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 16KB (5.5K x 24)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2.0
2.1
Getting started with the PIC24FJ16MC101/102 family
of 16-bit microcontrollers (MCUs) requires attention to
a minimal set of device pin connections before
proceeding with development. The following is a list of
pin names, which must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
© 2011 Microchip Technology Inc.
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(regardless if ADC module is not used)
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Connection (V
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Programming™ (ICSP™) and debugging purposes
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source is used
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Note 1: This data sheet summarizes the features
CAP
DD
Section 2.2 “Decoupling
Section 2.2 “Decoupling
Section 2.3 “CPU Logic Filter Capacitor
Section 2.4 “Master Clear (MCLR)
Section 2.5 “ICSP
Section 2.6 “External Oscillator
DD
2: It
3: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
MICROCONTROLLERS
Basic Connection Requirements
and V
and AV
of the PIC24FJ16MC101/102 family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the “PIC24F Family Refer-
ence Manual”. Please see the Microchip
web site (www.microchip.com) for the lat-
est PIC24F Family Reference Manual
sections.
specifications in
cal Characteristics”
supercede any specifications that may be
provided in PIC24F Family Reference
Manual sections.
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
this data sheet for device-specific register
and bit information.
SS
is
CAP
SS
pins
important
)”)
pins, if present on the device
Pins”)
Section 26.0 “Electri-
to
Capacitors”)
Capacitors”)
of this data sheet,
note
Pins”)
that
Pin”)
the
Preliminary
in
PIC24FJ16MC101/102
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10V – 20V. This capacitor
should be a low-ESR and have resonance
frequency in the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS39997B-page 17
SS
, AV
DD
, and