PIC24FJ16MC102-I/SP Microchip Technology, PIC24FJ16MC102-I/SP Datasheet - Page 19

• Manufacturer Part Number: PIC24FJ16MC102-I/SP
• Description: 16-bit Motor Control Family, 16 MIPS, 16KB Flash, 1KB RAM 28 SPDIP .300in TUBE
• Manufacturer: Microchip Technology
• Series: PIC® 24Fr

Specifications of PIC24FJ16MC102-I/SP

• Featured Product: PIC24FJ/33FJ MCUs & dsPIC® DSCs
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 16 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 16KB (5.5K x 24)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2.5
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP™) and debugging pur-
poses. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes, and capacitors on the
PGECx and PGEDx pins are not recommended as they
will
communications to the device. If such discrete
components are an application requirement, they
should
programming and debugging. Alternately, refer to the
AC/DC characteristics and timing requirements infor-
mation in the “PIC24FJXXMCXXX Flash Programming
Specification” for information on capacitive loading
limits and pin input voltage high (V
(V
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
ICE™.
For more information on ICD 2, ICD 3, and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip web
site.
• “MPLAB
• “Using MPLAB
• “MPLAB
• “Using MPLAB
• “MPLAB
• “MPLAB
• “Using MPLAB
© 2011 Microchip Technology Inc.
IL
Guide” (DS51331)
User’s Guide” (DS51616)
) requirements.
interfere
®
ICSP Pins
be
ICD 2, MPLAB ICD 3, or MPLAB REAL
®
®
®
®
ICD 2 In-Circuit Debugger User’s
ICD 2 Design Advisory” (DS51566)
ICD 3 Design Advisory” (DS51764)
REAL ICE™ In-Circuit Debugger
removed
®
®
®
with
ICD 2” (poster) (DS51265)
ICD 3” (poster) (DS51765)
REAL ICE™” (poster) (DS51749)
the
from
programmer/debugger
the
IH
) and input low
circuit
during
Preliminary
PIC24FJ16MC101/102
2.6
Many MCUs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to
Configuration”
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in
FIGURE 2-3:
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
External Oscillator Pins
for details).
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
Figure
Section 8.0 “Oscillator
DS39997B-page 19
2-3.
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