SPAKDSP303AG100 Freescale Semiconductor, SPAKDSP303AG100 Datasheet - Page 15

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SPAKDSP303AG100

Manufacturer Part Number
SPAKDSP303AG100
Description
IC DSP 24BIT 100MHZ 144-LQFP
Manufacturer
Freescale Semiconductor
Series
DSP563xxr
Type
Fixed Pointr
Datasheets

Specifications of SPAKDSP303AG100

Interface
Host Interface, SSI, SCI
Clock Rate
100MHz
Non-volatile Memory
ROM (576 B)
On-chip Ram
24kB
Voltage - I/o
3.30V
Voltage - Core
3.30V
Operating Temperature
-40°C ~ 100°C
Mounting Type
Surface Mount
Package / Case
144-LQFP
Device Core Size
24b
Clock Freq (max)
100MHz
Mips
100
Device Input Clock Speed
100MHz
Ram Size
24KB
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SPAKDSP303AG100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
1.5 DSP56300 Core
Core features are fully described in the DSP56300 Family Manual. This manual, in contrast,
documents pinout, memory, and peripheral features. Core features are as follows:
Freescale Semiconductor
100 million instructions per second (MIPS) with a 100 MHz clock at 3.0–3.6 V
Highly parallel instruction set
Data arithmetic logic unit (Data ALU)
— Fully pipelined 24 × 24-bit parallel multiplier-accumulator (MAC)
— 56-bit parallel barrel shifter (fast shift and normalization; bit stream generation and
— Conditional ALU instructions
— 24-bit or 16-bit arithmetic support under software control
Program control unit (PCU)
— Position Independent Code (PIC) support
— Addressing modes optimized for DSP applications (including immediate offsets)
— Instruction cache controller
— Internal memory-expandable hardware stack
— Nested hardware DO loops
— Fast auto-return interrupts
Direct memory access (DMA)
— Six DMA channels supporting internal and external accesses
— One-, two-, and three- dimensional transfers (including circular buffering)
— End-of-block-transfer interrupts
— Triggering from interrupt lines and all peripherals
Phase lock loop (PLL)
— Allows change of low power Divide Factor (DF) without loss of lock
— Output clock with skew elimination
Hardware debugging support
— On-chip emulation (OnCE) module
— Joint Test Action Group (JTAG) Test Access Port (TAP)
— Address Trace mode reflects internal program RAM accesses at the external port
Reduced power dissipation
— Very low-power CMOS design
— Wait and stop low-power standby modes
— Fully-static design specified to operate down to 0 Hz (dc)
— Optimized power-management circuitry (instruction-dependent, peripheral-dependent,
parsing)
and mode-dependent)
DSP56303 User’s Manual, Rev. 2
DSP56300 Core
1-5

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