pnx1700 NXP Semiconductors, pnx1700 Datasheet - Page 496
pnx1700
Manufacturer Part Number
pnx1700
Description
Connected Media Processor
Manufacturer
NXP Semiconductors
Datasheet
1.PNX1700.pdf
(832 pages)
- Current page: 496 of 832
- Download datasheet (8Mb)
Philips Semiconductors
Volume 1 of 1
PNX17XX_SER_1
Preliminary data sheet
2.7.4 MBE Interrupt
2.7.5 OVERFLOW Interrupt (Message Passing Mode Only)
2.8 Record or Message Counters
2.9 Timestamp
Capture continues upon receipt of either BUF1FULL_ACK or BUF2FULL_ACK or
both. Refer to
OVERRUN condition is ‘sticky’ and can only be cleared by software writing a ‘1’ to the
FGPI_IR_CLR.OVERRUN_ACK bit.
A Memory Bandwidth Error (MBE) interrupt is generated when received samples can
not be loaded into the main memory adapter FIFO. One or more data samples will be
lost until the adapter FIFO can accept samples. Sample capture resumes at the
correct address.
The MBE condition is ‘sticky’ and can only be cleared by software writing a ‘1’ to the
FGPI_IR_CLR.MBE_ACK bit.
If the message length overflows the value programmed in the FGPI_REC_SIZE
register, the message is truncated and the FGPI_IR_STATUS.OVERFLOW interrupt
will be generated.
The OVERFLOW condition is ‘sticky’ and can only be cleared by software writing a ‘1’
to the FGPI_IR_CLR.OVERFLOW_ACK bit.
The registers FGPI_NREC1 and FGPI_NREC2 count the number of complete
records or messages transferred to memory. The counters are incremented when a
record or message stop event is seen. The counters are cleared to zero when the
associated FGPI_BASEn register is updated.
Reading a FGPI_NRECn register while the associated buffer is active MAY NOT
RETURN THE ACTUAL TRANSFER COUNT (can be less than or equal to the actual
count) due to clock domain crossing logic. The best time to read a FGPI_NRECn
register is during the associated BUFnFULL interrupt service routine as the counter is
not updated during this time.
See
information on how to use FGPI_NRECn while the associated buffer is active.
If enabled, by setting FGPI_CTL.TSTAMP_SELECT bit to ‘1’, a 4-byte time-of-arrival
word giving the record or message start event time is written to main memory before
sample data.
The timestamp clock is derived from the main timestamp clock which runs at 13.5
MHz when the GPIO module module is clocked by the 108 MHz clock.
–
–
–
–
Section 2.7.2 THRESH1_REACHED and THRESH2_REACHED Interrupts
a buffer full event has occurred and
the buffer full interrupt has not been acknowledged and
the corresponding enable bit is set and
a new record or message start event has arrived
Figure 4 on page 14-11
Rev. 1 — 17 March 2006
Chapter 14: FGPI: Fast General Purpose Interface
to see which buffer capture resumes in. The
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
PNX17xx Series
for
14-9
Related parts for pnx1700
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: