s71ws256nc0bawa30 Meet Spansion Inc., s71ws256nc0bawa30 Datasheet - Page 13

• Manufacturer Part Number: s71ws256nc0bawa30
• Description: Stacked Multi-chip Product Mcp 256/512/128 Megabit 32m/16m/8m X 16 Bit Cmos 1.8 Volt-only Simultaneous Read/write, Burst-mode Flash Memory With 128/64megabit 8m/4m X 16-bit Psram.
• Manufacturer: Meet Spansion Inc.

2
September 15, 2005 S71WS-N_01_A4
Ordering Information
The ordering part number is formed by a valid combination of the following:
Package Marking Note:
The package marking omits the leading S from the ordering part number.
Valid Combinations list configurations planned to be supported in volume for this device. Consult
your local sales office to confirm availability of specific valid combinations and to check on newly
released combinations.
S71WS 256
S71WS128N
S71WS256N
S71WS512N
A d v a n c e
N
C
0
I n f o r m a t i o n
BA
S71WS-Nx0 Based MCPs
C
D
C
D
W
Valid Combinations
A
0
Valid Combinations
3
0
BA, BF
Packing Type
0
2
3
RAM Supplier, DYB Power Up, Speed Combinations
3
7
2
6
Package Modifier
A
E
Y
Temperature Range
W
Package Type
BA
BF
Chip Contents—2
No content
pSRAM Density
C = 64 Mb
D = 128 Mb
Process Technology
N
Flash Density
512
256
Device Family
S71WS=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
Tray
7” Tape and Reel
13” Tape and Reel
RAM Type 4, 0, 54 MHz
RAM Type 4, 1, 54 MHz
RAM Type 4, 0, 66 MHz
RAM Type 4, 1, 66 MHz
1.2 mm, 8 x 11.6, 84-ball FBGA
1.2 mm, 9 x 12, 84-ball FBGA
1.4 mm, 9 x 12, 84-ball FBGA
Wireless (-25°C to +85°C)
Very Thin Fine-Pitch BGA
Lead (Pb)-free Compliant Package
Very Thin Fine-Pitch BGA
Lead (Pb)-free Package
110nm MirrorBit™ Technology
512Mb (2x256Mb)
256Mb
Multi-Chip Product
1.8 Volt-only Simultaneous Read/Write Burst Mode
Flash Memory + xRAM
W
A
E
A
Y
E
2, 6, 3, 7
2, 6, 3, 7
2, 6, 3, 7
3, 7
2, 6
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