s71ws256nc0bawa30 Meet Spansion Inc., s71ws256nc0bawa30 Datasheet - Page 16

• Manufacturer Part Number: s71ws256nc0bawa30
• Description: Stacked Multi-chip Product Mcp 256/512/128 Megabit 32m/16m/8m X 16 Bit Cmos 1.8 Volt-only Simultaneous Read/write, Burst-mode Flash Memory With 128/64megabit 8m/4m X 16-bit Psram.
• Manufacturer: Meet Spansion Inc.

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5.1
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Connection Diagrams/Physical Dimensions
Special Handling Instructions for FBGA Packages
This section contains the I/O designations and package specifications for the S71WS-N.
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning meth-
ods. The package and/or data integrity may be compromised if the package body is exposed to
temperatures above 150° C for prolonged periods of time.
A d v a n c e
S71WS-Nx0 Based MCPs
I n f o r m a t i o n
S71WS-N_01_A4 September 15, 2005