s71ws256nc0bawa30 Meet Spansion Inc., s71ws256nc0bawa30 Datasheet - Page 3

• Manufacturer Part Number: s71ws256nc0bawa30
• Description: Stacked Multi-chip Product Mcp 256/512/128 Megabit 32m/16m/8m X 16 Bit Cmos 1.8 Volt-only Simultaneous Read/write, Burst-mode Flash Memory With 128/64megabit 8m/4m X 16-bit Psram.
• Manufacturer: Meet Spansion Inc.

General Description
Distinctive Characteristics
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not
design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
S71WS-Nx0 Based MCPs
Stacked Multi-Chip Product (MCP)
128/256/512 Megabit (32M/16M x 16 bit) CMOS
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with
pSRAM Type 4
The S71WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists
of the following items:
The products covered by this document are listed in the table below. For details about their spec-
ifications, please refer to the individual constituent datasheet for further details.
MCP Features
Publication Number S71WS-N_01
One or more flash memory die
pSRAM Type 4—Compatible pSRAM
Power supply voltage of 1.7 V to 1.95 V
Burst Speed: 54 MHz, 66 MHz
Package
— 8 x 11.6 mm, 9 x 12 mm
Operating Temperature
— Wireless, –25° C to +85° C
S71WS512ND0
S71WS256ND0
S71WS256NC0
S71WS128NC0
Device
512 Mb
Revision A
256 Mb
Flash Density
Amendment 4
128 Mb
64 Mb
Issue Date September 15, 2005
128 Mb
64 Mb
pSRAM Density
INFORMATION
ADVANCE
32 Mb
16 Mb