MT41J128M8 MDTIC [Micon Design Technology Corporation], MT41J128M8 Datasheet - Page 28

• Manufacturer Part Number: MT41J128M8
• Description: 1Gb: x4, x8, x16 DDR3 SDRAM
• Manufacturer: MDTIC [Micon Design Technology Corporation]

Thermal Characteristics
Table 8:
Figure 13: Thermal Measurement Point
PDF: 09005aef826aa906/Source: 09005aef82a357c3
1Gb_DDR3_D2.fm - Rev. D 8/1/08 EN
Thermal Characteristics
Notes:
1. MAX operating case temperature. T
2. A thermal solution must be designed to ensure the DRAM device does not exceed the maxi-
3. Device functionality is not guaranteed if the DRAM device exceeds the maximum T
4. If T
5. The thermal resistance data is based off of a number of samples from multiple lots and
Parameter/Condition
Operating case temperature
Junction-to-case (TOP)
L
Figure 13
mum T
operation.
interval refresh rate. The use of SRT or ASR (if available) must be enabled.
should be viewed as a typical number.
C
(L/2)
exceeds 85°C, the DRAM must be refreshed externally at 2X refresh, which is a 3.9µs
C
during operation.
).
W
28
(W/2)
78-ball
86-ball
96-ball
C
is measured in the center of the package (see
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T c test point
1Gb: x4, x8, x16 DDR3 SDRAM
Symbol
ΘJC
T
T
C
C
Thermal Characteristics
0 to 85
0 to 95
Value
3.2
2.8
2.8
©2006 Micron Technology, Inc. All rights reserved.
Units
°C/W
°C
°C
1, 2, 3, 4
C
Notes
1, 2, 3
during
5