AMD-K6 AMD [Advanced Micro Devices], AMD-K6 Datasheet - Page 279

• Manufacturer Part Number: AMD-K6
• Description: AMD-K6 Processor
• Manufacturer: AMD [Advanced Micro Devices]

20695H/0—March 1998
Heat Dissipation Path
Chapter 17
The following example calculates the required thermal
resistance of a heatsink:
If:
Then:
Thermal grease is recommended as interface material because
it provides the lowest thermal resistance ( 0.20°C/W). The
required thermal resistance (
example is calculated as follows:
Figure 93 illustrates the processor’s heat dissipation path. Most
of the heat generated by the processor is dissipated from the
top surface (ceramic and lid) of the package. The small amount
of heat generated from the bottom side of the processor where
the processor socket blocks the convection can be safely
ignored.
Figure 93. Processor Heat Dissipation Path
T
T
P
C
A
MAX
= 70°C
= 45°C
= 20.0W at 200MHz
SA
CA
Thermal Design
=
CA
T
------------------ -
P
C
–
MAX
–
T
IF
A
Ambient Temperature
Case temperature
= 1.25 – 0.20 = 1.05 (°C/W)
=
----------------- -
20.0W
25 C
SA
=
) of the heatsink in this
AMD-K6
1.25
®
C W
Processor Data Sheet
Thin Lid
261