UJA1061TW PHILIPS [NXP Semiconductors], UJA1061TW Datasheet - Page 59

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UJA1061TW

Manufacturer Part Number
UJA1061TW
Description
Low speed CAN/LIN system basis chip
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet

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Philips Semiconductors
2004 Mar 22
Low speed CAN/LIN system basis chip
The value R
Without any PCB, R
With a 4-layer JEDEC PCB with an effective area of 50 x 50 mm, Rth(c-a) = 32.5 K/W.
th(c-a)
depends on the PCB used.
th(c-a)
= 113 K/W.
Fig.14 Thermal model of HTTSOP32 package.
V1 power
17 K/W
V2 power
43 K/W
59
T
T
V3 power
4 K/W
R
amb
case
th(c-a)
(heatsink)
29 K/W
remainder
001aaa345
1 K/W
T
vj
Objective specification
UJA1061

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