SE97 NXP [NXP Semiconductors], SE97 Datasheet - Page 14

• Manufacturer Part Number: SE97
• Description: DDR memory module temp sensor with integrated SPD, 3.3 V
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
SE97_5
Product data sheet
Fig 10. SMBus/I
Fig 11. SMBus/I
SDA
SDA
SCL
SCL
SDA
SDA
SDA
SCL
SCL
SCL
repeated
by host
by host
START
START
by host
START
by host
SR
S
S
A = ACK = Acknowledge bit. W = Write bit = 0. R = Read bit = 1.
A = ACK = Acknowledge bit. A = NACK = No Acknowledge bit. W = Write bit = 0. R = Read bit = 1.
D15
D15
A6
A6
A6
1
1
1
1
1
D14
2
2
D14
A5
A5
A5
C-bus write to the Pointer register followed by a write data word
C-bus write to Pointer register followed by a repeated START and an immediate data word read
2
2
2
2
2
returned most significant byte data
most significant byte data
device address and write
device address and write
device address and read
D13
D13
A4
A4
A4
3
3
3
3
3
D12
D12
A3
A3
A3
4
4
4
4
4
D11
D11
A2
A2
A2
5
5
5
5
5
D10
D10
A1
A1
A1
6
6
6
6
6
D9
A0
D9
A0
A0
7
7
7
7
7
Rev. 05 — 6 August 2009
DDR memory module temp sensor with integrated SPD, 3.3 V
D8
W
D8
W
8
8
R
8
8
8
by device
by device
by device
by device
by host
ACK
ACK
ACK
ACK
ACK
A
A
9
9
9
A
9
A
9
A
(cont.)
(cont.)
D7
D7
D7
D7
1
1
1
1
D6
D6
D6
D6
2
2
2
2
returned least significant byte data
D5
D5
D5
D5
3
3
least significant byte data
3
3
write register address
read register address
D4
D4
D4
D4
4
4
4
4
D3
D3
D3
D3
5
5
5
5
D2
D2
D2
D2
6
6
6
6
D1
D1
D1
D1
7
7
7
7
© NXP B.V. 2009. All rights reserved.
D0
D0
D0
D0
8
8
8
8
by device
by device
by device
by host
ACK
NACK
ACK
ACK
A
A
A
9
9
A
9
9
SE97
002aab412
002aac686
(cont.)
(cont.)
(cont.)
(cont.)
by host
by host
STOP
STOP
14 of 54
P
P