SE97 NXP [NXP Semiconductors], SE97 Datasheet - Page 50

• Manufacturer Part Number: SE97
• Description: DDR memory module temp sensor with integrated SPD, 3.3 V
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
14. Abbreviations
SE97_5
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 33.
Acronym
ADC
ARA
CDM
CMOS
CPU
DDR
DIMM
DRAM
ECC
EEPROM
ESD
HBM
I
LSB
MM
MSB
PC
PCB
POR
2
Fig 44. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Analog-to-Digital Converter
Alert Response Address
Charged-Device Model
Complementary Metal-Oxide Semiconductor
Central Processing Unit
Double Data Rate
Dual In-line Memory Module
Dynamic Random Access Memory
Error-Correcting Code
Electrically Erasable Programmable Read-Only Memory
ElectroStatic Discharge
Human Body Model
Inter-Integrated Circuit bus
Least Significant Bit
Machine Model
Most Significant Bit
Personal Computer
Printed-Circuit Board
Power-On Reset
Rev. 05 — 6 August 2009
DDR memory module temp sensor with integrated SPD, 3.3 V
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
temperature
peak
© NXP B.V. 2009. All rights reserved.
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