SE97 NXP [NXP Semiconductors], SE97 Datasheet - Page 44

• Manufacturer Part Number: SE97
• Description: DDR memory module temp sensor with integrated SPD, 3.3 V
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
12. Package outline
Fig 40. Package outline SOT530-1 (TSSOP8)
SE97_5
Product data sheet
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT530-1
max.
1.1
A
0.15
0.05
A 1
1
0.95
0.85
8
A 2
y
IEC
e
pin 1 index
Z
0.25
A 3
D
0.30
0.19
b p
b p
5
4
MO-153
0
0.20
0.13
JEDEC
c
w
REFERENCES
M
D
3.1
2.9
(1)
Rev. 05 — 6 August 2009
DDR memory module temp sensor with integrated SPD, 3.3 V
c
E
4.5
4.3
(2)
JEITA
scale
A 2
0.65
2.5
e
A 1
H E
6.5
6.3
0.94
L
H E
E
detail X
0.7
0.5
L p
5 mm
L
0.1
v
L p
PROJECTION
EUROPEAN
0.1
w
(A 3 )
A
0.1
y
A
0.70
0.35
X
Z
© NXP B.V. 2009. All rights reserved.
(1)
v
ISSUE DATE
M
00-02-24
03-02-18
A
8
0
SOT530-1
SE97
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