SE97 NXP [NXP Semiconductors], SE97 Datasheet - Page 38

no-image

SE97

Manufacturer Part Number
SE97
Description
DDR memory module temp sensor with integrated SPD, 3.3 V
Manufacturer
NXP [NXP Semiconductors]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SE977
Manufacturer:
AD
Quantity:
5 080
Part Number:
SE979LMRD-LF
Manufacturer:
MSUNG
Quantity:
20 000
Company:
Part Number:
SE979LMRD-LF
Quantity:
87
Part Number:
SE979MRD-LF
Manufacturer:
TRIDENT
Quantity:
129
Part Number:
SE979MRD-LF
Manufacturer:
SAMSUNG
Quantity:
1 000
Part Number:
SE97BTP
Manufacturer:
NXP
Quantity:
10 000
Part Number:
SE97BTP
Manufacturer:
NXP
Quantity:
7 250
Part Number:
SE97BTP/L547
Manufacturer:
NEC
Quantity:
6 586
Part Number:
SE97BTP547
0
NXP Semiconductors
Table 29.
V
[1]
SE97_5
Product data sheet
Symbol
I
I
V
V
V
V
V
V
I
I
I
I
I
C
I
I
Z
Z
DD(AV)
sd(VDD)
OL(sink)EVENT
OL(sink)(SDA)
LOH
LIH
LIL
L
pd
DD
IL
IH
IH
IL
OL1
OL2
I(ov)
POR
i(SCL/SDA)
= 1.7 V to 3.6 V; T
High-voltage input voltage applied to pin A0 during RWP and CRWP operations. The JEDEC specification is 7 V (min.) and 10 V (max.),
but since the SE97 EEPROM write works only down to 3.0 V, the condition of V
minimum voltage changed to 7.8 V. If V
DC characteristics
Parameter
average supply current
supply voltage shutdown mode
current
HIGH-level input voltage
LOW-level input voltage
LOW-level output voltage 1
LOW-level output voltage 2
overvoltage input voltage
power-on reset voltage
LOW-level output sink current on
pin EVENT
LOW-level output sink current on
pin SDA
HIGH-level output leakage current
HIGH-level input leakage current
LOW-level input leakage current
SCL and SDA input capacitance
leakage current
pull-down current
LOW-level input impedance
HIGH-level input impedance
amb
= 40 C to +125 C; unless otherwise specified. These specifications are guaranteed by design.
DD
is 3.6 V then the minimum voltage is 8.4 V.
Rev. 05 — 6 August 2009
DDR memory module temp sensor with integrated SPD, 3.3 V
Conditions
SMBus inactive
SMBus inactive
SCL, SDA;
V
SCL, SDA;
V
V
V
pin A0; V
power supply rising
power supply falling
V
V
EVENT; V
SDA, SCL; V
SDA, SCL; V
A0, A1, A2; V
on A0, A1, A2
internal; A0, A1, A2 pins;
V
pins A0, A1, A2; V
pins A0, A1, A2
DD
DD
DD
DD
OL1
OL2
I
SE97PW, SE97TK
SE97TL, SE97TP
SE97PW, SE97TK
SE97TL, SE97TP
= 0.3V
= 3.0 V to 3.6 V
= 3.0 V to 3.6 V
= 3.0 V; I
= 1.7 V; I
= 0.4 V
= 0.5 V
I(ov)
DD
OH
to V
I
I
= V
I
OL
OL
= V
= V
= V
V
DD
= 3 mA
= 1.5 mA
DD
DD
DD
SS
SS
I
< 0.3V
> 4.8 V
I(ov)
> 4.8 V + V
DD
[1]
Min
-
-
0.7
-
-
-
7.8
-
0.1
0.6
2
6
3
-
-
-
30
800
DD
1.0
1.0
1.0
1.0
or > 4.8 V + 3.0 V was applied and the
V
DD
Typ
250
0.1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
5
1
-
-
-
© NXP B.V. 2009. All rights reserved.
Max
400
5.0
V
0.3
0.4
0.5
10
1.7
-
-
-
-
-
+1.0
+1.0
+1.0
+1.0
10
-
4.0
-
-
DD
+ 1
SE97
V
DD
38 of 54
Unit
V
V
V
V
V
V
V
V
mA
mA
mA
pF
k
k
A
A
A
A
A
A
A
A

Related parts for SE97