SE97 NXP [NXP Semiconductors], SE97 Datasheet - Page 36

• Manufacturer Part Number: SE97
• Description: DDR memory module temp sensor with integrated SPD, 3.3 V
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
10. Limiting values
SE97_5
Product data sheet
Calculation example:
Self heating due to power dissipation for HVSON8 is:
Self heating due to power dissipation for TSSOP8 is:
Table 27.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
V
V
I
T
T
sink
j(max)
stg
T
T
DD
n
A0
V
V
I
I
T
I
V
Maximum V
I
V
I
R
R
OL(sink)(SDA)
OL(sink)EVENT
DD(AV)
OL(sink)(SDA)
OL(sink)EVENT
amb
OL(SDA)
OL(EVENT)
DD
OL(EVENT)
th(j-a)
th(j-a)
=
=
= 3.6 V
56
160
(typical temperature inside the notebook) = 50 C
of HVSON8 = 56 C/W
of TSSOP8 = 160 C/W
= 400 A
Parameter
supply voltage
voltage on any other pin
voltage on pin A0
sink current
maximum junction temperature
storage temperature
Limiting values
= LOW-level output voltage on pin SDA
= LOW-level output voltage on pin EVENT
= 0.4 V
3.6 0.4
OL(SDA)
= SDA output current LOW
= 1 mA
3.6 0.4
= EVENT output current LOW
= 3 mA
= 0.4 V
+
Rev. 05 — 6 August 2009
DDR memory module temp sensor with integrated SPD, 3.3 V
+
0.4 3
0.4 3
+
+
0.4 1
0.4 1
Conditions
SDA, SCL, EVENT pins
overvoltage input; A0 pin
at SDA, SCL, EVENT pins
=
=
56 C W
160 C W
3.04 mW
3.04 mV
=
Min
-
=
0.17 C
0.3
0.3
0.3
1
65
© NXP B.V. 2009. All rights reserved.
0.49 C
Max
+4.2
+4.2
+12.5
+50.0
150
+165
SE97
36 of 54
Unit
V
V
V
mA
C
C
(2)
(3)