SE97 NXP [NXP Semiconductors], SE97 Datasheet - Page 23

• Manufacturer Part Number: SE97
• Description: DDR memory module temp sensor with integrated SPD, 3.3 V
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
Table 9.
[1]
SE97_5
Product data sheet
Bit
Symbol
Default
Access
Bit
Symbol
Default
Access
The SE97 A0 pin can support up to 10 V, but the final die was already taped out before the JC42.4 ballot 1435.00 register change could
be implemented. Bit 5 is changed from ‘0’ to ‘1’ on the future 1.7 V to 3.6 V SE97B.
Capability register (address 00h) bit allocation
8.2 Capability register (00h, 16-bit read-only)
15
R
0
R
7
0
Table 10.
RFU
Bit
15:6
5
4:3
2
1
0
14
R
0
R
6
0
Symbol
RFU
VHV
TRES
WRNG
HACC
BCAP
Capability register (address 00h) bit description
VHV
13
0
R
0
R
5
[1]
Rev. 05 — 6 August 2009
DDR memory module temp sensor with integrated SPD, 3.3 V
Description
Reserved for future use; must be zero.
High voltage standoff for pin A0.
Temperature resolution.
Wider range.
Higher accuracy (set during manufacture).
Basic capability.
0 — default
1 — This part can support a voltage up to 10 V on the A0 pin to
support JC42.4 ballot 1435.00.
10 — 0.125 C LSB (11-bit)
1 — can read temperatures below 0 C and set sign bit accordingly
1 — B grade accuracy
1 — has Alarm and Critical Trips interrupt capability
12
R
0
R
4
1
TRES
RFU
11
R
0
R
3
0
WRNG
10
R
0
R
2
1
HACC
R
9
0
R
1
1
© NXP B.V. 2009. All rights reserved.
SE97
BCAP
R
8
0
R
0
1
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