SE97 NXP [NXP Semiconductors], SE97 Datasheet - Page 8

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SE97

Manufacturer Part Number
SE97
Description
DDR memory module temp sensor with integrated SPD, 3.3 V
Manufacturer
NXP [NXP Semiconductors]
Datasheet

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0
NXP Semiconductors
Table 3.
SE97_5
Product data sheet
Figure
note
(1)
(2)
(3)
(4)
(5)
(6)
Fig 7.
EVENT in ‘Critical Temp only’ mode
Refer to
EVENT output condition
EVENT output boundary
conditions
T
T
T
T
T
T
EVENT output condition
amb
amb
amb
amb
amb
amb
EVENT in Comparator mode
EVENT in Interrupt mode
< T
> T
< T
Upper Boundary Alarm
Lower Boundary Alarm
software interrupt clear
Table 3
T
T
T
trip(l)
trip(l)
trip(u)
trip(u)
th(crit)
th(crit)
temperature ( C)
When T
and bit 0 of CONFIG (EVENT output mode) is ignored.
for figure note information.
T
T
T
hys
hys
hys
critical
amb
T
(1)
amb
Comparator
T
th(crit)
mode
H
H
L
L
L
L
and T
Rev. 05 — 6 August 2009
T
DDR memory module temp sensor with integrated SPD, 3.3 V
trip(l)
EVENT output
amb
Interrupt
T
hys
< T
mode
H
L
L
L
L
L
(2)
th(crit)
T
trip(u)
(1) (3)
Critical Temp
T
T
hys
only mode
hys
the EVENT output is in Comparator mode
H
H
H
H
H
L
(4)
(3)(5)
Temperature Register Status bits
Critical
Above
Bit 15
Trip
0
0
0
0
1
0
*
(6) (4)
T
th(crit)
002aae324
Window
Above
Alarm
Bit 14
T
(2)
trip(u)
0
0
1
0
1
1
© NXP B.V. 2009. All rights reserved.
T
hys
T
trip(l)
T
time
hys
SE97
T
Window
hys
Below
Alarm
Bit 13
0
1
0
0
0
0
8 of 54

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