SE97 NXP [NXP Semiconductors], SE97 Datasheet - Page 46

• Manufacturer Part Number: SE97
• Description: DDR memory module temp sensor with integrated SPD, 3.3 V
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
Fig 42. Package outline SOT1052-1 (HXSON8)
SE97_5
Product data sheet
HXSON8: plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; body 2 x 3 x 0.5 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Dimension A is including plating thickness. The package footprint is compatible with JEDEC MO229
mm
SOT1052-1
UNIT
VERSION
OUTLINE
max
nom
min
A
0.5
(1)
terminal 1
index area
terminal 1
index area
0.04
A
1
L
E
IEC
h
X
0.3
0.2
b
1
8
e
2.1
2.0
1.9
D
b
D
D
h
1.6
1.4
D
MO-229
JEDEC
1
1/2 e
4
5
REFERENCES
3.1
3.0
2.9
E
v
Rev. 05 — 6 August 2009
M
DDR memory module temp sensor with integrated SPD, 3.3 V
B
1.6
1.4
E
A
1
0
B
A
E
JEITA
0.5
e
scale
0.45
0.35
1
L
0.1
v
2 mm
A
0.05
y
A
1
y
0.05
y
1
(8 )
1
C
detail X
PROJECTION
EUROPEAN
C
y
© NXP B.V. 2009. All rights reserved.
ISSUE DATE
08-01-11
08-03-11
SOT1052-1
SE97
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