SE97 NXP [NXP Semiconductors], SE97 Datasheet - Page 47

• Manufacturer Part Number: SE97
• Description: DDR memory module temp sensor with integrated SPD, 3.3 V
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
Fig 43. Package outline SOT1069-1 (HWSON8)
SE97_5
Product data sheet
HWSON8: plastic thermal enhanced very very thin small outline package; no leads;
8 terminals; body 2 x 3 x 0.8 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Dimension A is including plating thickness. The package footprint is compatible with JEDEC MO229
mm
SOT1069-1
UNIT
VERSION
OUTLINE
max
nom
min
A
0.8
(1)
terminal 1
index area
terminal 1
index area
0.04
A
1
IEC
L
E
X
0.3
0.2
h
b
2.1
2.0
1.9
1
8
D
e
b
1.6
1.4
D
MO-229
JEDEC
D
D
1
h
1/2 e
REFERENCES
3.1
3.0
2.9
E
4
5
Rev. 05 — 6 August 2009
DDR memory module temp sensor with integrated SPD, 3.3 V
v
1.6
1.4
E
1
M
0
B
A
JEITA
0.5
e
B
A
E
scale
0.45
0.35
1
L
A
0.1
v
2 mm
A
1
0.05
y
y
1
(8 )
C
0.05
y
detail X
1
PROJECTION
EUROPEAN
C
y
© NXP B.V. 2009. All rights reserved.
ISSUE DATE
08-06-11
08-07-10
SOT1069-1
SE97
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