SE97 NXP [NXP Semiconductors], SE97 Datasheet - Page 51

• Manufacturer Part Number: SE97
• Description: DDR memory module temp sensor with integrated SPD, 3.3 V
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
15. Revision history
Table 34.
SE97_5
Product data sheet
Document ID
SE97_5
Modifications:
Revision history
Release date
20090806
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Table 33.
Section 1 “General
Section 2.1 “General
– 1
– 3
– 8
Table 1 “Ordering
Section 7.3.2.1 “Alarm
– 1
– 1
– 2
– 2
Section 7.3.2.2 “Critical trip”
– 1
– Advisory notification, Competitor devices: re-written
– Advisory notification, Work-around: changed from “Wait at least 125 ms before enabling EVENT
Section 7.7 “SMBus
– 1
– added 2
Section 7.8 “SMBus Alert Response Address
Table 12 “Configuration register (address 01h) bit
3 bullet items
Table 29 “DC
– I
– I
– I
Acronym
RDIMM
SMBus
SO-DIMM
SPD
and 95 C”
and Event bit 3 (EOCTL) are set ... “ to “when new UPPER or LOWER Alarm Windows and the
EVENT output are set ...”
to “... through the Clear EVENT bit (CEVNT) ...
output, Intel will change Nehalem BIOS so that T
bit 3 (EOCTL) is enabled and Event value is checked.” to “Wait at least 125 ms before enabling
EVENT output (EOCTL = 1), Intel will change Nehalem BIOS so that T
125 ms before EVENT output is enabled and Event value is checked.
SCL LOW between 25 ns and 35 ns”
DD(AV)
DD(AV)
sd(VDD)
st
rd
th
st
st
nd
nd
st
st
bullet item: changed from “SO-DIMM” to “TSE 2002B3 DIMM
Advisory notification, Competitor device: appended “(CEVNT)” to end of phrase
Advisory notification, Work-around: appended “(CEVNT)” to end of phrase
paragraph, last sentence: changed from “... through the Clear EVENT bit ...”
paragraph, 2
bullet item: changed from “3.0 A (max.)” to “5.0 A (max.)”
bullet item: appended “(JEDEC PSON8 VCED-3)”
Advisory notification, Competitor devices: changed from “... when new UPPER or LOWER
Advisory notification, Work-around: appended “(EOCTL = 1)” to end of phrase
: removed condition “V
: removed sub-row with condition “V
: changed Max value from “3 A” to “5.0 A”
nd
Abbreviations
characteristics”:
“Remark”
Data sheet status
Product data sheet
information”,
nd
Description
Registered Dual In-line Memory Module
System Management Bus
Small Outline Dual In-line Memory Module
Serial Presence Detect
description”, 7
time-out”:
features”:
sentence changed from “... holds SCL LOW more than 35 ms” to “... holds
window”:
Rev. 05 — 6 August 2009
DDR memory module temp sensor with integrated SPD, 3.3 V
…continued
Table note [2]
DD
th
= 3.0 V to 3.6 V”
paragraph: deleted 5
re-written
DD
(ARA)”: added 2
= 1.7 V”
Change notice
-
description”, bit 8, SHMD: added “Remark” and
th(crit)
th
is set for more than 125 ms before Event
sentence
nd
“Remark”
0.5 C (typ.) between 75 C
th(crit)
Supersedes
SE97_4
is set for more than
© NXP B.V. 2009. All rights reserved.
SE97
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