SE97 NXP [NXP Semiconductors], SE97 Datasheet - Page 37

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SE97

Manufacturer Part Number
SE97
Description
DDR memory module temp sensor with integrated SPD, 3.3 V
Manufacturer
NXP [NXP Semiconductors]
Datasheet

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0
NXP Semiconductors
11. Characteristics
Table 28.
V
SE97_5
Product data sheet
Symbol
T
T
T
E
DD
lim(acc)
res
conv
f(conv)
= 3.0 V to 3.6 V; T
SE97 thermal sensor characteristics
Parameter
temperature limit accuracy
temperature resolution
conversion period
conversion rate error
amb
= 40 C to +125 C; unless otherwise specified.
Conditions
B grade; V
conversion time from STOP bit
to conversion complete
percentage error in
programmed data
T
T
T
amb
amb
amb
Rev. 05 — 6 August 2009
DDR memory module temp sensor with integrated SPD, 3.3 V
= 75 C to 95 C
= 40 C to 125 C
= 40 C to +125 C
DD
= 3.3 V
10 %
Min
-
-
1.0
2.0
3.0
30
Typ
< 0.5
< 1.0
< 2
0.125
100
-
© NXP B.V. 2009. All rights reserved.
Max
+1.0
+2.0
+3.0
-
120
+30
SE97
Unit
ms
%
37 of 54
C
C
C
C

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