PM8610-BIAP PMC [PMC-Sierra, Inc], PM8610-BIAP Datasheet - Page 336

• Manufacturer Part Number: PM8610-BIAP
• Description: SBS Telecom Standard Product Data Sheet Preliminary
• Manufacturer: PMC [PMC-Sierra, Inc]

19.1
19.2
19
Proprietary and Confidential to PMC-Sierra, Inc., and for its Customers’ Internal Use
Document ID: PMC-2000168, Issue 3
Ordering and Thermal Information
Packaging Information
Thermal Information
The SBS is designed to operate over a wide temperature range and is suited for industrial
applications such as outside plant equipment.
Notes
1.
2.
3.
4.
Maximum long-term operating junction temperature to ensure adequate long-term
life.
Maximum junction temperature for short-term excursions with guaranteed continued
functional performance.
reaches 85 ºC.
Minimum ambient temperature
Thermal Resistance vs Air Flow
Airflow
Device Compact Model
Operating power is dissipated in package (watts) at
worst case power supply
Power (watts)
PM8610-BIAP
Part No.
JA
JT
JB
Short-term is understood as the definition stated in Telcordia Generic Requirements GR-63-Core.
JESD51 (2S2P)
resistance are obtained by simulating conditions described in JEDEC Standard, JESD 15-8.
At 1.44 W in the 352 UBGA package, the SBS will not need any airflow in a dense board application.
(
(
(
0
0
0
JA
JB
C/W)
C/W)
C/W)
, the junction-to-board thermal resistance and
, the total junction to ambient thermal resistance as measured according to JEDEC Standard
Description
352-pin Ball Grid Array (UBGA)
3
1
This condition will typically be reached when local ambient
1.44
4
2
0.3
7.08
16.7
Natural Convection
JT,
the residual junction to ambient thermal
SBS Telecom Standard Product Data Sheet
Ambient
Board
Junction
JB
200 LFM
11.45
JT
105 ºC
125 ºC
-40 ºC
Compact
Device
Model
400 LFM
10.14
Preliminary
336