TMPSNS-RTD1 Microchip Technology, TMPSNS-RTD1 Datasheet - Page 6
TMPSNS-RTD1
Manufacturer Part Number
TMPSNS-RTD1
Description
BOARD EVAL PT100 RTD TEMP SENSOR
Manufacturer
Microchip Technology
Datasheets
1.MCP3301-CIMS.pdf
(32 pages)
2.PCM18XR1.pdf
(438 pages)
3.MCP6S22DM-PICTL.pdf
(43 pages)
4.TMPSNS-RTD1.pdf
(26 pages)
Specifications of TMPSNS-RTD1
Sensor Type
Temperature
Interface
USB
Embedded
Yes, MCU, 8-Bit
Utilized Ic / Part
MCP3301, MCP6S26, PIC18F2550
Processor To Be Evaluated
MCP6S26, MCP3301, MCP6024, MCP41010, PIC18F2550, TC1071, MCP6002
Data Bus Width
12 bit
Interface Type
USB
Lead Free Status / RoHS Status
Not applicable / Not applicable
Voltage - Supply
-
Sensitivity
-
Sensing Range
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Not applicable / Not applicable
- MCP3301-CIMS PDF datasheet
- PCM18XR1 PDF datasheet #2
- MCP6S22DM-PICTL PDF datasheet #3
- TMPSNS-RTD1 PDF datasheet #4
- Current page: 6 of 438
- Download datasheet (7Mb)
PIC18F2455/2550/4455/4550
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 113
11.0 Timer0 Module ......................................................................................................................................................................... 127
12.0 Timer1 Module ......................................................................................................................................................................... 131
13.0 Timer2 Module ......................................................................................................................................................................... 137
14.0 Timer3 Module ......................................................................................................................................................................... 139
15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 143
16.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 151
17.0 Universal Serial Bus (USB) ...................................................................................................................................................... 165
18.0 Streaming Parallel Port ............................................................................................................................................................ 191
19.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 197
20.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 243
21.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 265
22.0 Comparator Module.................................................................................................................................................................. 275
23.0 Comparator Voltage Reference Module ................................................................................................................................... 281
24.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 285
25.0 Special Features of the CPU .................................................................................................................................................... 291
26.0 Instruction Set Summary .......................................................................................................................................................... 313
27.0 Development Support............................................................................................................................................................... 363
28.0 Electrical Characteristics .......................................................................................................................................................... 367
29.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 407
30.0 Packaging Information.............................................................................................................................................................. 409
Appendix A: Revision History............................................................................................................................................................. 419
Appendix B: Device Differences......................................................................................................................................................... 419
Appendix C: Conversion Considerations ........................................................................................................................................... 420
Appendix D: Migration From Baseline to Enhanced Devices............................................................................................................. 420
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 421
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 421
Index .................................................................................................................................................................................................. 423
The Microchip Web Site ..................................................................................................................................................................... 433
Customer Change Notification Service .............................................................................................................................................. 433
Customer Support .............................................................................................................................................................................. 433
Reader Response .............................................................................................................................................................................. 434
PIC18F2455/2550/4455/4550 Product Identification System ............................................................................................................ 435
DS39632E-page 4
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 23
Power-Managed Modes ............................................................................................................................................................. 35
Reset .......................................................................................................................................................................................... 45
Memory Organization ................................................................................................................................................................. 59
Flash Program Memory .............................................................................................................................................................. 81
Data EEPROM Memory ............................................................................................................................................................. 91
8 x 8 Hardware Multiplier............................................................................................................................................................ 97
Interrupts .................................................................................................................................................................................... 99
© 2009 Microchip Technology Inc.
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