DEMO9S08EL32 Freescale Semiconductor, DEMO9S08EL32 Datasheet - Page 3

• Manufacturer Part Number: DEMO9S08EL32
• Description: BOARD DEMO FOR 9S08 EL MCU
• Manufacturer: Freescale Semiconductor
• Type: MCUr

Specifications of DEMO9S08EL32

• Contents: Evaluation Board
• Processor To Be Evaluated: MC9S08EL32
• Data Bus Width: 8 bit
• Interface Type: RS-232, USB
• Operating Supply Voltage: 12 V
• Silicon Manufacturer: Freescale
• Core Architecture: HCS08
• Core Sub-architecture: HCS08
• Silicon Core Number: MC9S08
• Silicon Family Name: S08EL
• Rohs Compliant: Yes
• For Use With/related Products: MC9S08EL32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MC9S08EL32 Features
8-Bit HCS08 Central Processor Unit (CPU)
On-Chip Memory
Power-Saving Modes
Clock Source Options
System Protection
Development Support
• 40-MHz HCS08 CPU (central processor unit)
• HC08 instruction set with added BGND instruction
• Support for up to 32 interrupt/reset sources
• FLASH read/program/erase over full operating
• EEPROM in-circuit programmable memory;
• Random-access memory (RAM)
• Security circuitry to prevent unauthorized access
• Two very low-power stop modes
• Reduced power wait mode
• Very low-power real-time interrupt for use in run,
• Oscillator (XOSC) — Loop-control Pierce
• Internal clock source (ICS) — Contains a
• Watchdog computer operating properly (COP)
• Low-voltage detection with reset or interrupt;
• Illegal opcode detection with reset
• Illegal address detection with reset
• FLASH and EEPROM block protect
• Single-wire background debug interface
• Breakpoint capability allows single breakpoint
• In-circuit emulation (ICE) debug module —
voltage and temperature
program and erase while executing FLASH; erase
abort
to RAM and NVM contents
wait, and stop
oscillator; Crystal or ceramic resonator range of
31.25 kHz to 38.4 kHz or 1 MHz to 16 MHz
frequency-locked loop (FLL) controlled by internal
or external reference; precision trimming of
internal reference allows 0.2% resolution and 2%
deviation over temperature and voltage; supports
bus frequencies from 2–20 MHz
reset with option to run from dedicated 1-kHz
internal clock source or bus clock
selectable trip points
setting during in-circuit debugging (plus two more
breakpoints in the on-chip debug module)
contains two comparators and nine trigger modes;
eight-deep FIFO for storing change-of-flow
address and event-only data; supports both tag
and force breakpoints
Peripherals
Input/Output
Package Options
• ADC — 16-channel, 10-bit resolution, 2.5 μs
• ACMPx — Two analog comparators with
• SCI — Full duplex non-return to zero (NRZ); LIN
• SLIC — Supports LIN 2.0 and SAE J2602
• SPI — Full-duplex or single-wire bidirectional;
• IIC — Up to 100 kbps with maximum bus loading;
• TPMx — One 4-channel (TPM1) and one
• RTC — 8-bit modulus real-time counter with
• 22 general purpose I/O pins
• 16 interrupt pins with selectable polarity
• Hysteresis and configurable pull up device on all
• 28-TSSOP
• 20-TSSOP
conversion time, automatic compare function,
temperature sensor, internal bandgap reference
channel; runs in stop3
selectable interrupt on rising, falling, or either
edge of comparator output; compare option to
fixed internal bandgap reference voltage; output
can optionally be routed to TPM module; runs in
stop3
master extended break generation; LIN slave
extended break detection; wake-up on active
edge
protocols; up to 120 kbps, full LIN message
buffering, automatic bit rate and frame
synchronization, checksum generation and
verification, UART-like byte transfer mode
double-buffered transmit and receive; master or
slave mode; MSB-first or LSB-first shifting
Multi-master operation; Programmable slave
address; Interrupt driven byte-by-byte data
transfer
2-channel (TPM2); selectable input capture,
output compare, or buffered edge- or
center-aligned PWM on each channel
binary or decimal based prescaler; external clock
source for precise time base, time-of-day,
calendar, or task scheduling functions; free
running on-chip low power oscillator (1 kHz) for
cyclic wake-up without external components
input pins; Configurable slew rate and drive
strength on all output pins.