HD6417020SX20IV Renesas Electronics America, HD6417020SX20IV Datasheet - Page 488

SH 1 CORE 32B MPU, 20MHZ/5V, 100

HD6417020SX20IV

Manufacturer Part Number
HD6417020SX20IV
Description
SH 1 CORE 32B MPU, 20MHZ/5V, 100
Manufacturer
Renesas Electronics America
Series
SuperH® SH7020r
Datasheet

Specifications of HD6417020SX20IV

Core Processor
SH-1
Core Size
32-Bit
Speed
20MHz
Connectivity
EBI/EMI, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
32
Program Memory Type
ROMless
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Table 19.8 Bus Timing (3) (cont)
Conditions: V
*: Normal products. Ta = –40 to +85 C for wide-temperature range products
Item
DACK0, DACK1 delay time 1 t
DACK0, DACK1 delay time 2 t
DACK0, DACK1 delay time 3 t
DACK0, DACK1 delay time 4 t
DACK0, DACK1 delay time 5 t
Read delay time 35% duty
Data setup time for CAS
CAS setup time for RAS
Row address hold time
Write command hold time
Write command 35% duty
setup time
Access time from CAS
precharge
Notes: 1. When frequency is 10 MHz or more.
RENESAS 476
2. n is the number of wait cycles.
3. –5 ns for parity output of DRAM long-pitch access
4. It is not necessary to meet the t
*4
specification is met.
CC
= 3.0 to 5.5 V, V
50% duty
50% duty
*1
*1
Symbol Min Max
t
t
t
t
t
t
t
t
DACD1
DACD2
DACD3
DACD4
DACD5
RDD
DS
CSR
RAH
WCH
WCS
WCS
ACP
SS
= 0 V, = 12.5 MHz, Ta = –20 to +75 C*
0*
10
10
15
0
0
tcyc
-20
3
RDS
40
40
40
40
40
t
t
cyc
cyc
specification as long as the access time
0.35 + 35
0.5 + 35
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Figures
19.21, 19.22, 19.24–
19.27, 19.32, 19.33
19.22, 19.26, 19.27,
19.32
19.24, 19.25
19.21, 19.22, 19.24-
19.28, 19.32
19.24, 19.26
19.29–19.31
19.24, 19.26
19.24
19.25

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