MC56F8122VFAE Freescale Semiconductor, MC56F8122VFAE Datasheet - Page 125

IC DSP 16BIT 40MHZ 48-LQFP

MC56F8122VFAE

Manufacturer Part Number
MC56F8122VFAE
Description
IC DSP 16BIT 40MHZ 48-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheet

Specifications of MC56F8122VFAE

Core Processor
56800
Core Size
16-Bit
Speed
40MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
21
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Ram Size
4K x 16
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 6x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
48-LQFP
Data Bus Width
16 bit
Processor Series
MC56F81xx
Core
56800E
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Data Ram Size
8 KB
Operating Supply Voltage
- 0.3 V to + 4 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Data Rom Size
8 KB
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC56F8122VFAE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
C, the internal [dynamic component], is classic C*V
56800E core and standard cell logic.
D, the external [dynamic component], reflects power dissipated on-chip as a result of capacitive loading
on the external pins of the chip. This is also commonly described as C*V
of the IO cell types used on the 56800E reveal that the power-versus-load curve does have a non-zero
Y-intercept.
Note: V
Power due to capacitive loading on output pins is (first order) a function of the capacitive load and
frequency at which the outputs change.
in the IO cells as a function of capacitive load. In these cases:
where:
Because of the low duty cycle on most device pins, power dissipation due to capacitive loads was found
to be fairly low when averaged over a period of time.
E, the external [static component], reflects the effects of placing resistive loads on the outputs of the
device. Sum the total of all V
0.5 for the purposes of these rough calculations. For instance, if there is a total of eight PWM outputs
driving 10mA into LEDs, then P = 8*.5*.01 = 40mW.
In previous discussions, power consumption due to parasitics associated with pure input pins is ignored,
as it is assumed to be negligible.
Freescale Semiconductor
Preliminary
Summation is performed over all output pins with capacitive loads
TotalPower is expressed in mW
Cload is expressed in pF
REFH
is tied to V
TotalPower = Σ((Intercept + Slope*Cload)*frequency/10MHz)
DDA
Table 10-25 IO Loading Coefficients at 10MHz
PDU08DGZ_ME
PDU04DGZ_ME
2
and V
/R or IV to arrive at the resistive load contribution to power. Assume V =
REFLO
56F8322 Technical Data, Rev. 16
Table 10-25
is tied to V
provides coefficients for calculating power dissipated
2
Intercept
SSA
1.15mW
*F CMOS power dissipation corresponding to the
1.3
inside this package.
0.11mW / pF
0.11mW / pF
Slope
2
*F, although simulations on two
Power Consumption
125

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