MC56F8122VFAE Freescale Semiconductor, MC56F8122VFAE Datasheet - Page 131

• Manufacturer Part Number: MC56F8122VFAE
• Description: IC DSP 16BIT 40MHZ 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8122VFAE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number Of I /o: 21
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• Ram Size: 4K x 16
• Voltage - Supply (vcc/vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 6x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 48-LQFP
• Data Bus Width: 16 bit
• Processor Series: MC56F81xx
• Core: 56800E
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Data Ram Size: 8 KB
• Operating Supply Voltage: - 0.3 V to + 4 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Rom Size: 8 KB
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Part 12 Design Considerations
12.1 Thermal Design Considerations
An estimation of the chip junction temperature, T
T
where:
The junction to ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single-layer board and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is closer to the application
depends on the power dissipated by other components on the board. The value obtained on a single layer
board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the
internal planes is usually appropriate if the board has low-power dissipation and the components are well
separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
R
where:
R
change the case-to-ambient thermal resistance, R
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the
Thermal Characterization Parameter (Ψ
measurement of the temperature at the top center of the package case using the following equation:
T
where:
Freescale Semiconductor
Preliminary
T
R
P
R
R
R
T
Ψ
P
J
J
D
θJA
θJC
D
A
T
θJΑ
θJA
θJC
θCA
JT
= T
= T
is device related and cannot be influenced by the user. The user controls the thermal environment to
= R
A
T
= Ambient temperature for the package (
= Junction to ambient thermal resistance (
= Power dissipation in the package (W)
=
=
=
= Thermocouple temperature on top of package (
= Thermal characterization parameter (
= Power dissipation in package (W)
+ (Ψ
+ (R
θJC
Package junction to ambient thermal resistance °C/W
Package junction to case thermal resistance °C/W
Package case to ambient thermal resistance °C/W
+ R
θJΑ
JT
x P
θCA
x P
D
D
)
)
56F8322 Technical Data, Rev. 16
JT
) can be used to determine the junction temperature with a
θCA
o
o
J
C)/W
, can be obtained from the equation:
C)
o
C/W)
. For instance, the user can change the size of the heat
o
C)
Thermal Design Considerations
131