MC56F8345VFGE Freescale Semiconductor, MC56F8345VFGE Datasheet - Page 156

• Manufacturer Part Number: MC56F8345VFGE
• Description: IC DSP 16BIT 60MHZ 128-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8345VFGE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 49
• Program Memory Size: 136KB (68K x 16)
• Program Memory Type: FLASH
• Ram Size: 6K x 16
• Voltage - Supply (vcc/vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 128-LQFP
• Data Bus Width: 16 bit
• Processor Series: MC56F83xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 60 MIPs
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 49
• Data Ram Size: 8 KB
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Interface Type: SCI, SPI, CAN
• Minimum Operating Temperature: - 40 C
• For Use With: MC56F8367EVME - EVAL BOARD FOR MC56F83X
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

10.17 Power Consumption
This section provides additional detail which can be used to optimize power consumption for a given
application.
Power consumption is given by the following equation:
A, the internal [static component], is comprised of the DC bias currents for the oscillator, leakage current,
PLL, and voltage references. These sources operate independently of processor state or operating
frequency.
B, the internal [state-dependent component], reflects the supply current required by certain on-chip
resources only when those resources are in use. These include RAM, Flash memory and the ADCs.
C, the internal [dynamic component], is classic C*V
56800E core and standard cell logic.
D, the external [dynamic component], reflects power dissipated on-chip as a result of capacitive loading
on the external pins of the chip. This is also commonly described as C*V
of the IO cell types used on the device reveal that the power-versus-load curve does have a non-zero
Y-intercept.
156
Total power =
1.
2.
3.
4.
Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling; 1.8pf
Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing; 2.04pf
Equivalent resistance for the ESD isolation resistor and the channel select mux; 500 ohms
Sampling capacitor at the sample and hold circuit. Capacitor C1 is normally disconnected from the input and is only
connected to it at sampling time; 1pf
Analog Input
+D: external [dynamic component]
+B: internal [state-dependent component]
+C: internal [dynamic component]
+E: external [static]
A: internal [static component]
1
Figure 10-22 Equivalent Circuit for A/D Loading
2
56F8345 Technical Data, Rev. 17
(V
REFH
3
- V
REFLO
2
*F CMOS power dissipation corresponding to the
) / 2
S1
S2
4
S3
C1
C2
S/H
2
*F, although simulations on two
C1 = C2 = 1pF
Freescale Semiconductor
Preliminary