MC9S12NE64VTUE Freescale Semiconductor, MC9S12NE64VTUE Datasheet - Page 124

IC MCU 64K FLASH EEPROM 80-TQFP

MC9S12NE64VTUE

Manufacturer Part Number
MC9S12NE64VTUE
Description
IC MCU 64K FLASH EEPROM 80-TQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12NE64VTUE

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
EBI/EMI, Ethernet, I²C, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
38
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.375 V ~ 3.465 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
Processor Series
S12N
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
125 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
- 0.3 V to + 3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12NE64E, DEMO9S12NE64E
Minimum Operating Temperature
- 65 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
25MHz
Total Internal Ram Size
8KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
2.625/3.465V
Operating Supply Voltage (min)
2.357/2.375/3.135V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
80
Package Type
TQFP
For Use With
EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

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Quantity
Price
Part Number:
MC9S12NE64VTUE
Manufacturer:
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Quantity:
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Part Number:
MC9S12NE64VTUE
Manufacturer:
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Chapter 3 Port Integration Module (PIM9NE64V1)
This register always reads back the status of the associated pins. This can be also used to detect overload
or short circuit conditions on output pins.
3.3.2.4.3
Read:Anytime.
Write:Anytime.
This register configures each port H pin as either input or output.
DDRH[6:0] — Data Direction Port H
Due to internal synchronization circuits, it can take up to 2 bus cycles until the correct value is read on PTH
or PTIH registers, when changing the DDRH register.
If the EMAC MII external interface is enabled, pins PH[6:0] become MII_TXER, MII_TXEN,
MII_TXCLK, MII_TXD[3:0]. In that case, DDRH[6:0] bits have no effect on their I/O direction.
3.3.2.4.4
Read:Anytime.
Write:Anytime.
This register configures the drive strength of each port H output pin as either full or reduced. If the port is
used as input this bit is ignored.
RDRH[6:0] — Reduced Drive Port H
124
1 = Associated pin is configured as output.
0 = Associated pin is configured as input.
1 = Associated pin drives at about 1/3 of the full drive strength.
0 = Full drive strength at output.
Module Base + $1A
Module Base + $1B
Reset:
Reset:
Read:
Read:
Write:
Write:
Data Direction Register (DDRH)
Reduced Drive Register (RDRH)
Bit 7
Bit 7
0
0
= Reserved or unimplemented
= Reserved or unimplemented
Figure 3-26. Port H Reduced Drive Register (RDRH)
DDRH6
RDRH6
Figure 3-25. Port H Data Direction Register (DDRH)
6
0
6
0
MC9S12NE64 Data Sheet, Rev. 1.1
DDRH5
RDRH5
5
0
5
0
DDRH4
RDRH4
4
0
4
0
DDRH3
RDRH3
3
0
3
0
DDRH2
RDRH2
2
0
2
0
DDRH1
RDRH1
1
0
1
0
Freescale Semiconductor
DDRH0
RDRH0
Bit 0
Bit 0
0
0

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