MC9S12NE64VTUE Freescale Semiconductor, MC9S12NE64VTUE Datasheet - Page 19

• Manufacturer Part Number: MC9S12NE64VTUE
• Description: IC MCU 64K FLASH EEPROM 80-TQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12NE64VTUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.375 V ~ 3.465 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Processor Series: S12N
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 125 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: - 0.3 V to + 3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12NE64E, DEMO9S12NE64E
• Minimum Operating Temperature: - 65 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.625/3.465V
• Operating Supply Voltage (min): 2.357/2.375/3.135V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: TQFP
• For Use With: EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 1
MC9S12NE64 Device Overview
1.1
The MC9S12NE64 is a 112-/80-pin cost-effective, low-end connectivity applications MCU family. The
MC9S12NE64 is composed of standard on-chip peripherals including a 16-bit central processing unit
(HCS12 CPU), 64K bytes of FLASH EEPROM, 8K bytes of RAM, Ethernet media access controller
(EMAC) with integrated 10/100 Mbps Ethernet physical transceiver (EPHY), two asynchronous serial
communications interface modules (SCI), a serial peripheral interface (SPI), one inter-IC bus (IIC), a
4-channel/16-bit timer module (TIM), an 8-channel/10-bit analog-to-digital converter (ATD), up to 21 pins
available as keypad wakeup inputs (KWU), and two additional external asynchronous interrupts. The
inclusion of a PLL circuit allows power consumption and performance to be adjusted to suit operational
requirements. Furthermore, an on-chip bandgap-based voltage regulator (VREG_PHY) generates the
internal digital supply voltage of 2.5 V (VDD) from a 3.15 V to 3.45 V external supply range. The
MC9S12NE64 has full 16-bit data paths throughout. The 112-pin package version has a total of 70 I/O port
pins and 10 input-only pins available. The 80-pin package version has a total of 38 I/O port pins and 10
input-only pins available.
1.1.1
Freescale Semiconductor
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16-bit HCS12 core
— HCS12 CPU
— Memory map and interface (MMC)
— Interrupt control (INT)
— Background debug mode (BDM)
— Enhanced debug12 module, including breakpoints and change-of-flow trace buffer (DBG)
— Multiplexed expansion bus interface (MEBI) — available only in 112-pin package version
Wakeup interrupt inputs
— Up to 21 port bits available for wakeup interrupt function with digital filtering
Memory
— 64K bytes of FLASH EEPROM
— 8K bytes of RAM
Analog-to-digital converter (ATD)
— One 8-channel module with 10-bit resolution
— External conversion trigger capability
Introduction
Features
– Upward compatible with M68HC11 instruction set
– Interrupt stacking and programmer’s model identical to M68HC11
– Instruction queue
– Enhanced indexed addressing
MC9S12NE64 Data Sheet, Rev 1.0
19