MC9S12NE64VTUE Freescale Semiconductor, MC9S12NE64VTUE Datasheet - Page 60

• Manufacturer Part Number: MC9S12NE64VTUE
• Description: IC MCU 64K FLASH EEPROM 80-TQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12NE64VTUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.375 V ~ 3.465 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Processor Series: S12N
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 125 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: - 0.3 V to + 3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12NE64E, DEMO9S12NE64E
• Minimum Operating Temperature: - 65 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.625/3.465V
• Operating Supply Voltage (min): 2.357/2.375/3.135V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: TQFP
• For Use With: EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 1 MC9S12NE64 Device Overview
For further explanation on the modes, see the MEBI block description chapter.
1.4.2
The MC9S12NE64 provides a security feature that prevents the unauthorized read and write of the
memory contents
On-chip security can be compromised by user code. An extreme example would be user code that dumps
the contents of the internal program. This code would defeat the purpose of security. At the same time the
user may also wish to put a back door in the user program. An example of this would be the user
downloading a key through the SCI, which would allow access to a programming routine that could update
parameters.
1.4.2.1
After the user has programmed the FLASH, the MCU can be secured by programming the security bits
located in the FLASH module. These nonvolatile bits will keep the MCU secured through resetting the
MCU and through powering down the MCU.
The security byte resides in a portion of the FLASH array.
See the FLASH block description chapter for more details on the security configuration.
60
BKGD =
•
•
•
1.No security feature is absolutely secure. However, Freescale Semiconductor’s strategy is to make reading or copying
MODC
the FLASH difficult for unauthorized users.
0
0
0
0
1
1
1
1
Protection of the contents of FLASH
Operation in single-chip mode
Operation from external memory with internal FLASH disabled
Security
Securing the Microcontroller
MODB
PE6 =
1
0
0
1
1
0
0
1
1
. This feature allows:
MODA
PE5 =
0
1
0
1
0
1
0
1
ROMCTL
MC9S12NE64 Data Sheet, Rev 1.0
PP6 =
Table 1-6. Mode Selection
X
X
X
X
0
1
0
1
0
1
0
1
ROMON
Bit
1
1
0
0
1
0
1
0
1
1
0
1
Special Single Chip, BDM allowed and ACTIVE. BDM
is allowed in all other modes but a serial command is
required to make BDM active.
Emulation Expanded Narrow, BDM allowed.
Special Test (Expanded Wide), BDM allowed.
Emulation Expanded Wide, BDM allowed.
Normal Single Chip, BDM allowed.
Normal Expanded Narrow, BDM allowed.
Peripheral; BDM allowed but bus operations would
cause bus conflicts (must not be used).
Normal Expanded Wide, BDM allowed.
Mode Description
Freescale Semiconductor