MC9S12NE64VTUE Freescale Semiconductor, MC9S12NE64VTUE Datasheet - Page 343

• Manufacturer Part Number: MC9S12NE64VTUE
• Description: IC MCU 64K FLASH EEPROM 80-TQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12NE64VTUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.375 V ~ 3.465 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Processor Series: S12N
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 125 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: - 0.3 V to + 3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12NE64E, DEMO9S12NE64E
• Minimum Operating Temperature: - 65 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.625/3.465V
• Operating Supply Voltage (min): 2.357/2.375/3.135V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: TQFP
• For Use With: EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

11.4.6.1 Frame Structure
A transmitted MII management frame uses the MII_MDIO and MII_MDC pins. This frame has the
following format:
<pre><st><op><phyad><regad><ta><data><idle>
11.4.6.1.1
The preamble (pre) consists of 32 contiguous logic 1 bits on MII_MDIO with 32 corresponding cycles on
MII_MDC to provide the PHY with a pattern that it can use to establish synchronization. The preamble is
optional as determined by NOPRE.
11.4.6.1.2
The start of frame (st) is indicated by a <01> pattern. This pattern ensures transitions from the default logic
1 line state to 0 and then returns to 1.
11.4.6.1.3
The operation code (op) for a read instruction is <10>. For a write operation, the operation code is <01>.
11.4.6.1.4
The PHY address (phyad) is a 5-bit field, allowing up to 32 unique PHY addresses. The first address bit
transmitted is the MSB of the address.
11.4.6.1.5
The register address (regad) is a 5-bit field, allowing 32 individual registers to be addresses within each
PHY. The first register bit transmitted is the MSB of the address.
11.4.6.1.6
The turnaround (ta) field is a two bit time spacing between the register address field and the data field of
an MII management frame to avoid contention on the MII_MDIO signal during a read operation. For a
read transaction, both the MAC and the PHY remain in a high impedance state for the first bit time of the
turnaround. The PHY drives a 0 bit during the second bit time of the turnaround of a read transaction.
During a write transaction, the MAC drives a 1 bit for the first bit time of the turnaround and a 0 bit for
the second bit time of the turnaround.
11.4.6.1.7
The data (data) field is 16 bits wide. The first data bit transmitted and received is the MSB of the data.
11.4.6.1.8
During idle condition (idle), MII_MDIO is in the high impedance state.
Freescale Semiconductor
PRE (Preamble)
ST (Start of Frame)
OP (Operation Code)
PHYAD (PHY Address)
REGAD (Register Address)
TA (Turnaround)
DATA (Data)
IDLE (IDLE Condition)
MC9S12NE64 Data Sheet, Rev. 1.1
Functional Description
343