MC9S12NE64VTUE Freescale Semiconductor, MC9S12NE64VTUE Datasheet - Page 501

IC MCU 64K FLASH EEPROM 80-TQFP

MC9S12NE64VTUE

Manufacturer Part Number
MC9S12NE64VTUE
Description
IC MCU 64K FLASH EEPROM 80-TQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12NE64VTUE

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
EBI/EMI, Ethernet, I²C, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
38
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.375 V ~ 3.465 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
Processor Series
S12N
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
125 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
- 0.3 V to + 3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12NE64E, DEMO9S12NE64E
Minimum Operating Temperature
- 65 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
25MHz
Total Internal Ram Size
8KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
2.625/3.465V
Operating Supply Voltage (min)
2.357/2.375/3.135V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
80
Package Type
TQFP
For Use With
EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Quantity:
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Appendix A
Electrical Characteristics
This section contains the most accurate electrical information for the MC9S12NE64
microcontroller available at the time of publication. The information is subject to change.
This introduction is intended to give an overview on several common topics like power supply,
current injection etc.
A.1
The electrical parameters shown in this supplement are guaranteed by various methods. To give
the customer a better understanding the following classification is used and the parameters are
tagged accordingly in the tables where appropriate, under the “C” column heading.
P: Those parameters are guaranteed during production testing on each individual device.
C: Those parameters are achieved by the design characterization by measuring a statistically
relevant sample size across process variations. They are regularly verified by production monitors.
T: Those parameters are achieved by design characterization on a small sample size from typical
devices. All values shown in the typical column are within this category.
D: Those parameters are derived mainly from simulations.
A.2
The MC9S12NE64 uses several pins to supply power to the I/O ports, A/D converter, oscillator
and PLL, the Ethernet Physical Transceiver (EPHY), as well as the digital core.
Freescale Semiconductor
• The V
• The V
• The V
• V
• V
• V
• V
• PHY_VDDA, PHY_VSSA are power supply pins for EPHY analog
• PHY_VDDRX, PHY_VSSRX are power supply pins for EPHY receiver
DD1
DDPLL
SS1
DD1
Parameter Classification
Power Supply
, V
and V
DDX1
DDA
DDR
and V
The MC9S12NE64 is specified and tested at the 3.3-V range.
, V
SS1
, V
supplies the internal voltage regulator, and is the V
SSPLL
, V
SS2
, V
DD2
SSA
DDX2
DD2
are internally connected by metal
are internally connected by metal
supply the oscillator and the PLL
pair supplies the A/D converter and portions of the EPHY
, and V
, V
SSX1
SS2
, V
MC9S12NE64 Data Sheet, Rev. 1.1
are the supply pins for the digital logic
SSX2
pairs supply the I/O pins, and internal voltage regulator
NOTE
REGEN
signal
501

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