MC9S12NE64VTUE Freescale Semiconductor, MC9S12NE64VTUE Datasheet - Page 40

• Manufacturer Part Number: MC9S12NE64VTUE
• Description: IC MCU 64K FLASH EEPROM 80-TQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12NE64VTUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.375 V ~ 3.465 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Processor Series: S12N
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 125 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: - 0.3 V to + 3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12NE64E, DEMO9S12NE64E
• Minimum Operating Temperature: - 65 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.625/3.465V
• Operating Supply Voltage (min): 2.357/2.375/3.135V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: TQFP
• For Use With: EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 1 MC9S12NE64 Device Overview
The PRTIDH register is constructed of four hexadecimal digits (0xABCD) as follows:
Digit “A” = Family ID
Digit “B” = Memory ID (flash size)
Digit “C” = Major mask revision
Digit “D” = Minor mask revision
Currently, family IDs are:
0x0 = D family
0x1 = H family
0x2 = B family
0x3 = C family
0x4 = T family
0x5 = E family
0x6 = reserved
0x7 = reserved
0x8 = NE family
Current memory IDs are:
0x0 = 256K
0x1 = 128K
0x2 = 64K
0x3 = 32K
0x4 = 512K
The major and minor mask revision increments from 0x0 as follows:
The device memory sizes are located in two 8-bit registers MEMSIZ0 and MEMSIZ1 (addresses $001C
and $001D after reset).
and control (MMC) block description chapter for further details.
1.2
This section describes signals that connect off-chip. It includes a pinout diagram, a table of signal
properties, and detailed discussion of signals.
40
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•
Major mask increments on a complete (full/all layer) mask change.
Minor mask increments on a single or smaller than full mask change.
Signal Description
Table 1-3
MC9S12NE64
MC9S12NE64
shows the read-only values of these registers. See the module mapping
Table 1-3. Memory Size Registers
MC9S12NE64 Data Sheet, Rev 1.0
Register Name
MEMSIZ0
MEMSIZ1
Value
$03
$80
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