MC9S12NE64VTUE Freescale Semiconductor, MC9S12NE64VTUE Datasheet - Page 262

• Manufacturer Part Number: MC9S12NE64VTUE
• Description: IC MCU 64K FLASH EEPROM 80-TQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12NE64VTUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.375 V ~ 3.465 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Processor Series: S12N
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 125 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: - 0.3 V to + 3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12NE64E, DEMO9S12NE64E
• Minimum Operating Temperature: - 65 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.625/3.465V
• Operating Supply Voltage (min): 2.357/2.375/3.135V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: TQFP
• For Use With: EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 9 Serial Peripheral Interface (SPIV3)
9.1.3
Figure 9-1
registers, shifter logic, baud rate generator, master/slave control logic, and port control logic.
9.2
This section lists the name and description of all ports including inputs and outputs that do, or may, connect
off chip. The SPIV3 module has a total of four external pins.
9.2.1
This pin is used to transmit data out of the SPI module when it is configured as a master and receive data
when it is configured as slave.
262
Bus Clock
Interrupt
Request
SPI
External Signal Description
gives an overview on the SPI architecture. The main parts of the SPI are status, control, and data
Block Diagram
MOSI — Master Out/Slave In Pin
SPPR
SPI
SPI Baud Rate Register
Prescaler
SPI Control Register 1
SPI Control Register 2
Baud Rate Generator
SPI Status Register
SPI Data Register
Interrupt Control
SPIF
3
SPR
Clock Select
MODF
Counter
3
SPTEF
MC9S12NE64 Data Sheet, Rev. 1.1
Figure 9-1. SPI Block Diagram
Baud Rate
LSBFE=1
LSBFE=0
8
8
Control
Control
Master
Slave
Master Baud Rate
Slave Baud Rate
MSB
2
2
Shifter
LSBFE=1
LSBFE=0
LSBFE=0
LSBFE=1
CPOL
Clock
Shift
Phase +
Polarity
Control
Phase +
Polarity
Control
LSB
CPHA
Sample
Clock
BIDIROE
SPC0
data out
SCK in
SCK out
data in
Control
Logic
Freescale Semiconductor
Port
MOSI
SCK
SS