MC9S12NE64VTUE Freescale Semiconductor, MC9S12NE64VTUE Datasheet - Page 542

• Manufacturer Part Number: MC9S12NE64VTUE
• Description: IC MCU 64K FLASH EEPROM 80-TQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12NE64VTUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.375 V ~ 3.465 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Processor Series: S12N
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 125 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: - 0.3 V to + 3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12NE64E, DEMO9S12NE64E
• Minimum Operating Temperature: - 65 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.625/3.465V
• Operating Supply Voltage (min): 2.357/2.375/3.135V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: TQFP
• For Use With: EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Appendix A Electrical Characteristics
542
Conditions are VDDX = 3.3 V 5%, Junction Temperature -40˚C to +125˚C, C
1
Num
Affected by clock stretch: add N x t
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
1
2
3
4
5
6
7
8
9
C
P
P
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
Frequency of operation (E-clock)
Cycle time
Pulse width, E low
Pulse width, E high
Address delay time
Address valid time to E rise (PW
Muxed address hold time
Address hold to data valid
Data hold to address
Read data setup time
Read data hold time
Write data delay time
Write data hold time
Write data setup time
Address access time
E high access time
Read/write delay time
Read/write valid time to E rise (PW
Read/write hold time
Low strobe delay time
Low strobe valid time to E rise (PW
Low strobe hold time
NOACC strobe delay time
NOACC valid time to E rise (PW
NOACC hold time
IPIPO[1:0] delay time
IPIPO[1:0] valid time to E rise (PW
IPIPO[1:0] delay time
IPIPO[1:0] valid time to E fall
Table A-32. Expanded Bus Timing Characteristics (3.3 V Range)
cyc
1
1
(PW
1
Rating
1
1
where N=0,1,2 or 3, depending on the number of clock stretches.
(PW
EH
MC9S12NE64 Data Sheet, Rev. 1.1
EH
–t
DSR
–t
DDW
EL
EL
)
–t
–t
EL
EL
EL
)
LSD
AD
–t
–t
–t
P0D
)
RWD
LSD
)
)
)
)
Symbol
PW
PW
t
t
t
t
t
t
t
t
t
t
AHDS
t
t
t
t
t
t
ACCA
ACCE
t
t
t
t
t
t
t
DDW
DHW
DSW
RWD
RWV
RWH
t
MAH
DHR
NOD
NOH
t
t
DHA
DSR
NOV
LSD
LSV
LSH
P0D
P0V
P1D
P1V
cyc
AD
f
AV
o
EH
EL
LOAD
= 50 pF
62.5
Min
30
30
16
15
15
29
15
16
16
16
16
11
0
2
7
2
0
2
2
2
2
2
2
Typ
Freescale Semiconductor
Max
16.0
16
15
14
14
14
14
25
MHz
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns