MC56F8147VPYE Freescale Semiconductor, MC56F8147VPYE Datasheet - Page 156

IC DSP 16BIT 40MHZ 160-LQFP

MC56F8147VPYE

Manufacturer Part Number
MC56F8147VPYE
Description
IC DSP 16BIT 40MHZ 160-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheet

Specifications of MC56F8147VPYE

Core Processor
56800
Core Size
16-Bit
Speed
40MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
76
Program Memory Size
128KB (64K x 16)
Program Memory Type
FLASH
Ram Size
4K x 16
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
160-LQFP
Data Bus Width
16 bit
Processor Series
MC56F81xx
Core
56800E
Data Ram Size
4 KB
Interface Type
SPI, SCI, CAN
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
76
Number Of Timers
2
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
4 x 12 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Company
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Quantity
Price
Part Number:
MC56F8147VPYE
Manufacturer:
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Part Number:
MC56F8147VPYE
Manufacturer:
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Quantity:
10 000
Part 11 Packaging
Note: The 160 Map Ball Grid Array is not available in the 56F8147 device.
11.1 56F8347 Package and Pin-Out Information
This section contains package and pin-out information for the 56F8347. This device comes in a 160-pin
Low-profile Quad Flat Pack (LQFP) and 160 Map Ball Grid Array.
lay-out for the 160-pin LQFP, and
the mechanical parameters for the LQFP package and
pin-out for the 160-pin LQFP and
156
* When the on-chip regulator is disabled, these four pins become 2.5V V
PHASEA1
PHASEB1
GPIOB0
GPIOB1
GPIOB2
GPIOB3
INDEX1
HOME1
GPIOB4
PWMB0
PWMB1
PWMB2
V
V
V
V
CLKO
RXD0
CAP
TXD0
DD_IO
DD_IO
DD_IO
V
A10
A15
D10
A11
A12
A13
A14
V
PP
D7
D8
D9
A1
A2
A3
A4
A5
A6
A7
A8
A9
SS
4*
2
Pin 1
41
Figure 11-1 Top View, 56F8347 160-Pin LQFP Package
Orientation Mark
Figure 11-2
Table 11-2
56F8347 Technical Data, Rev.11
lists the pin-out for the 160 MBGA.
for the160 Map Ball Grid Array.
DD_CORE
Figure 11-3
.
for the MBGA.
Figure 11-1
Figure 11-5
81
121
Freescale Semiconductor
Table 11-1
shows the package
FAULTA1
FAULTA0
PWMA5
for the shows
ANB4
ANB2
ANB1
ANB0
V
V
ANA3
ANA1
RESET
RSTO
V
V
D5
D4
FAULTA3
D3
FAULTA2
D2
ANB3
V
V
V
V
V
TEMP_SENSE
ANA7
ANA6
ANA5
ANA4
ANA2
ANA0
CLKMODE
EXTAL
XTAL
VDDA_OSC_PLL
OCR_DIS
D6
SSA_ADC
DDA_ADC
REFH
REFMID
REFN
DD_IO
CAP
REFP
REFLO
3*
Preliminary
lists the

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