ATSAM3S4CA-AU Atmel, ATSAM3S4CA-AU Datasheet - Page 1058

• Manufacturer Part Number: ATSAM3S4CA-AU
• Description: IC MCU 32BIT 256KB FLASH 100LQFP
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S4CA-AU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 16x10/12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Controller Family/series: ATSAM3S
• No. Of I/o's: 79
• Ram Memory Size: 48KB
• Cpu Speed: 64MHz
• No. Of Timers: 6
• Rohs Compliant: Yes
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Cpu Family: AT91
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 64MHz
• Total Internal Ram Size: 48KB
• # I/os (max): 79
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.62V
• On-chip Adc: 16-chx12-bit
• On-chip Dac: 2-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

41.6
41.6.1
41.6.2
Table 41-26. Electrical Parameters
1058
Symbol
V
V
V
V
C
I
R
V
V
V
I
I
R
R
VDDIO
VDDCORE
OL
OH
IL
IH
DI
CM
CRS
IN
EXT
PUI
PUA
USB Transceiver Characteristics
SAM3S Preliminary
Typical Connection
Electrical Characteristics
Parameter
Low Level
High Level
Differential Input Sensitivity
Differential Input Common Mode
Range
Transceiver capacitance
Hi-Z State Data Line Leakage
Recommended External USB
Series Resistor
Low Level Output
High Level Output
Output Signal Crossover Voltage
Current Consumption
Current Consumption
Bus Pull-up Resistor on
Upstream Port (idle bus)
Bus Pull-up Resistor on
Upstream Port (upstream port
receiving)
For typical connection please refer to the USB Device Section.
Conditions
|(D+) - (D-)|
Capacitance to ground on each line
0V < V
In series with each USB pin with ±5%
Measured with R
3.6V
Measured with R
GND
Measure conditions described in
Figure 41-11 “USB Data Signal Rise
and Fall Times”
Transceiver enabled in input mode
DDP = 1 and DDM = 0
Pull-up Resistor
IN
Output Levels
Consumption
Input Levels
< 3.3V
L
L
of 1.425 kΩ tied to
of 14.25 kΩ tied to
0.900
1.425
Min
2.0
0.2
0.8
-10
0.0
2.8
1.3
Typ
105
27
80
6500C–ATARM–8-Feb-11
1.575
3.090
Max
9.18
+10
200
150
0.8
2.5
0.3
3.6
2.0
Unit
pF
µA
µA
µA
kΩ
kΩ
V
V
V
V
Ω
V
V
V