ATSAM3S4CA-AU Atmel, ATSAM3S4CA-AU Datasheet - Page 1110

• Manufacturer Part Number: ATSAM3S4CA-AU
• Description: IC MCU 32BIT 256KB FLASH 100LQFP
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S4CA-AU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 16x10/12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Controller Family/series: ATSAM3S
• No. Of I/o's: 79
• Ram Memory Size: 48KB
• Cpu Speed: 64MHz
• No. Of Timers: 6
• Rohs Compliant: Yes
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Cpu Family: AT91
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 64MHz
• Total Internal Ram Size: 48KB
• # I/os (max): 79
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.62V
• On-chip Adc: 16-chx12-bit
• On-chip Dac: 2-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

iv
SAM3S Preliminary
19 Fast Flash Programming Interface (FFPI) .......................................... 307
20 Cyclic Redundancy Check Calculation Unit (CRCCU) ..................... 319
21 SAM3S Boot Program .......................................................................... 341
22 Bus Matrix (MATRIX) ........................................................................... 347
23 Static Memory Controller (SMC) ......................................................... 361
18.2
18.3
18.4
19.1
19.2
20.1
20.2
20.3
20.4
20.5
20.6
20.7
21.1
21.2
21.3
21.4
21.5
22.1
22.2
22.3
22.4
22.5
22.6
22.7
22.8
23.1
23.2
23.3
23.4
Product Dependencies ..................................................................................291
Functional Description ...................................................................................291
Enhanced Embedded Flash Controller (EEFC) User Interface .....................302
Description .....................................................................................................307
Parallel Fast Flash Programming ..................................................................307
Description .....................................................................................................319
Embedded Characteristics ............................................................................319
CRCCU Block Diagram .................................................................................320
Product Dependencies ..................................................................................321
CRCCU Functional Description .....................................................................321
Transfer Control Registers Memory Mapping ................................................322
Cyclic Redundancy Check Calculation Unit (CRCCU) User Interface .........326
Description .....................................................................................................341
Hardware and Software Constraints ..............................................................341
Flow Diagram ................................................................................................341
Device Initialization ........................................................................................342
SAM-BA Monitor ............................................................................................343
Description .....................................................................................................347
Embedded Characteristics ............................................................................347
Memory Mapping ...........................................................................................348
Special Bus Granting Techniques .................................................................348
Arbitration ......................................................................................................349
System I/O Configuration ..............................................................................351
Write Protect Registers ..................................................................................351
Bus Matrix (MATRIX) User Interface .............................................................352
Description .....................................................................................................361
Embedded Characteristics ............................................................................361
I/O Lines Description .....................................................................................362
Product Dependencies ..................................................................................362
6500C–ATARM–8-Feb-11