ATSAM3S4CA-AU Atmel, ATSAM3S4CA-AU Datasheet - Page 348

• Manufacturer Part Number: ATSAM3S4CA-AU
• Description: IC MCU 32BIT 256KB FLASH 100LQFP
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S4CA-AU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 16x10/12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Controller Family/series: ATSAM3S
• No. Of I/o's: 79
• Ram Memory Size: 48KB
• Cpu Speed: 64MHz
• No. Of Timers: 6
• Rohs Compliant: Yes
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Cpu Family: AT91
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 64MHz
• Total Internal Ram Size: 48KB
• # I/os (max): 79
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.62V
• On-chip Adc: 16-chx12-bit
• On-chip Dac: 2-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

22.2.3
22.3
22.4
22.4.1
22.4.2
22.4.3
348
Memory Mapping
Special Bus Granting Techniques
SAM3S Preliminary
Master to Slave Access
No Default Master
Last Access Master
Fixed Default Master
All the Masters can normally access all the Slaves. However, some paths do not make sense,
for example allowing access from the Cortex-M3 S Bus to the Internal ROM. Thus, these paths
are forbidden or simply not wired and shown as “-” in the following table.
Table 22-3.
Bus Matrix provides one decoder for every AHB Master Interface. The decoder offers each AHB
Master several memory mappings. In fact, depending on the product, each memory area may be
assigned to several slaves. Booting at the same address while using different AHB slaves (i.e.
internal ROM or internal Flash) becomes possible.
The Bus Matrix provides some speculative bus granting techniques in order to anticipate access
requests from some masters. This mechanism allows to reduce latency at first accesses of a
burst or single transfer. The bus granting mechanism allows to set a default master for every
slave.
At the end of the current access, if no other request is pending, the slave remains connected to
its associated default master. A slave can be associated with three kinds of default masters: no
default master, last access master and fixed default master.
At the end of the current access, if no other request is pending, the slave is disconnected from
all masters. No Default Master suits low power mode.
At the end of the current access, if no other request is pending, the slave remains connected to
the last master that performed an access request.
At the end of the current access, if no other request is pending, the slave connects to its fixed
default master. Unlike last access master, the fixed master doesn’t change unless the user mod-
ifies it by a software action (field FIXED_DEFMSTR of the related MATRIX_SCFG).
To change from one kind of default master to another, the Bus Matrix user interface provides the
Slave Configuration Registers, one for each slave, that allow to set a default master for each
slave. The Slave Configuration Register contains two fields:
Slaves
0
1
2
3
4
SAM3S Master to Slave Access
External Bus Interface
Peripheral Bridge
Internal SRAM
Internal Flash
Internal ROM
Masters
Cortex-M3 I/D
Bus
X
X
0
-
-
-
Cortex-M3 S
Bus
X
X
X
1
-
-
6500C–ATARM–8-Feb-11
PDC
X
X
X
X
2
-
CRCCU
3
X
X
X
X
-