ATSAM3S4CA-AU Atmel, ATSAM3S4CA-AU Datasheet - Page 347

• Manufacturer Part Number: ATSAM3S4CA-AU
• Description: IC MCU 32BIT 256KB FLASH 100LQFP
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S4CA-AU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 16x10/12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Controller Family/series: ATSAM3S
• No. Of I/o's: 79
• Ram Memory Size: 48KB
• Cpu Speed: 64MHz
• No. Of Timers: 6
• Rohs Compliant: Yes
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Cpu Family: AT91
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 64MHz
• Total Internal Ram Size: 48KB
• # I/os (max): 79
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.62V
• On-chip Adc: 16-chx12-bit
• On-chip Dac: 2-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

22. Bus Matrix (MATRIX)
22.1
22.2
22.2.1
22.2.2
6500C–ATARM–8-Feb-11
Description
Embedded Characteristics
Matrix Masters
Matrix Slaves
The Bus Matrix implements a multi-layer AHB that enables parallel access paths between multi-
ple AHB masters and slaves in a system, which increases the overall bandwidth. Bus Matrix
interconnects 4 AHB Masters to 5 AHB Slaves. The normal latency to connect a master to a
slave is one cycle except for the default master of the accessed slave which is connected
directly (zero cycle latency).
The Bus Matrix user interface also provides a Chip Configuration User Interface with Registers
that allow to support application specific features.
The Bus Matrix of the SAM3S product manages 4 masters, which means that each master can
perform an access concurrently with others, to an available slave.
Each master has its own decoder, which is defined specifically for each master. In order to sim-
plify the addressing, all the masters have the same decodings.
Table 22-1.
The Bus Matrix of the SAM3S product manages 5 slaves. Each slave has its own arbiter, allow-
ing a different arbitration per slave.
Table 22-2.
Master 0
Master 1
Master 2
Master 3
Slave 0
Slave 1
Slave 2
Slave 3
Slave 4
List of Bus Matrix Masters
List of Bus Matrix Slaves
Internal SRAM
Internal ROM
Internal Flash
External Bus Interface
Peripheral Bridge
Cortex-M3 Instruction/Data
Cortex-M3 System
Peripheral DMA Controller (PDC)
CRC Calculation Unit
SAM3S Preliminary
347