ATSAM3S4CA-AU Atmel, ATSAM3S4CA-AU Datasheet - Page 401

• Manufacturer Part Number: ATSAM3S4CA-AU
• Description: IC MCU 32BIT 256KB FLASH 100LQFP
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S4CA-AU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 16x10/12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Controller Family/series: ATSAM3S
• No. Of I/o's: 79
• Ram Memory Size: 48KB
• Cpu Speed: 64MHz
• No. Of Timers: 6
• Rohs Compliant: Yes
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Cpu Family: AT91
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 64MHz
• Total Internal Ram Size: 48KB
• # I/os (max): 79
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.62V
• On-chip Adc: 16-chx12-bit
• On-chip Dac: 2-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

• DBW: Data Bus Width
• TDF_CYCLES: Data Float Time
This field gives the integer number of clock cycles required by the external device to release the data after the rising edge
of the read controlling signal. The SMC always provide one full cycle of bus turnaround after the TDF_CYCLES period. The
external bus cannot be used by another chip select during TDF_CYCLES + 1 cycles. From 0 up to 15 TDF_CYCLES can
be set.
• TDF_MODE: TDF Optimization
1: TDF optimization is enabled.
0: TDF optimization is disabled.
• PMEN: Page Mode Enabled
1: Asynchronous burst read in page mode is applied on the corresponding chip select.
0: Standard read is applied.
• PS: Page Size
If page mode is enabled, this field indicates the size of the page in bytes.
6500C–ATARM–8-Feb-11
• Ready Mode: The NWAIT signal indicates the availability of the external device at the end of the pulse of the controlling
read or write signal, to complete the access. If high, the access normally completes. If low, the access is extended until
NWAIT returns high.
– The number of TDF wait states is optimized using the setup period of the next read/write access.
– The number of TDF wait states is inserted before the next access begins.
Value
Value
0
1
2
3
0
1
2
3
Name
8_BIT
16_BIT
32_BIT
Name
4_BYTE
8_BYTE
16_BYTE
32_BYTE
Description
4-byte page
8-byte page
16-byte page
32-byte page
Description
8-bit bus
16-bit bus
32-bit bus
Reserved
SAM3S Preliminary
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