ATSAM3S4CA-AU Atmel, ATSAM3S4CA-AU Datasheet - Page 958

• Manufacturer Part Number: ATSAM3S4CA-AU
• Description: IC MCU 32BIT 256KB FLASH 100LQFP
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S4CA-AU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 16x10/12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Controller Family/series: ATSAM3S
• No. Of I/o's: 79
• Ram Memory Size: 48KB
• Cpu Speed: 64MHz
• No. Of Timers: 6
• Rohs Compliant: Yes
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Cpu Family: AT91
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 64MHz
• Total Internal Ram Size: 48KB
• # I/os (max): 79
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.62V
• On-chip Adc: 16-chx12-bit
• On-chip Dac: 2-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Read:
0 = There is no data to send.
1 = The data is waiting to be sent upon reception of token IN.
Write:
0 = Can be used in the procedure to cancel transmission data. (See,
Section 37.6.2.5 “Transmit Data Cancellation” on
page
939)
1 = A new data payload has been written in the FIFO by the firmware and is ready to be sent.
This flag is used to generate a Data IN transaction (device to host). Device firmware checks that it can write a data payload
in the FIFO, checking that TXPKTRDY is cleared. Transfer to the FIFO is done by writing in the UDP_FDRx register. Once
the data payload has been transferred to the FIFO, the firmware notifies the USB device setting TXPKTRDY to one. USB
bus transactions can start. TXCOMP is set once the data payload has been received by the host.
After setting or clearing this bit, a wait time of 3 UDPCK clock cycles and 3 peripheral clock cycles is required before
accessing DPR.
• FORCESTALL: Force Stall (used by Control, Bulk and Isochronous Endpoints)
Read:
0 = Normal state.
1 = Stall state.
Write:
0 = Return to normal state.
1 = Send STALL to the host.
Refer to chapters 8.4.5 and 9.4.5 of the Universal Serial Bus Specification, Rev. 2.0 for more information on the STALL
handshake.
Control endpoints: During the data stage and status stage, this bit indicates that the microcontroller cannot complete the
request.
Bulk and interrupt endpoints: This bit notifies the host that the endpoint is halted.
The host acknowledges the STALL, device firmware is notified by the STALLSENT flag.
• RX_DATA_BK1: Receive Data Bank 1 (only used by endpoints with ping-pong attributes)
This flag generates an interrupt while it is set to one.
Write (Cleared by the firmware):
0 = Notifies USB device that data have been read in the FIFO’s Bank 1.
1 = To leave the read value unchanged.
Read (Set by the USB peripheral):
0 = No data packet has been received in the FIFO's Bank 1.
1 = A data packet has been received, it has been stored in FIFO's Bank 1.
When the device firmware has polled this bit or has been interrupted by this signal, it must transfer data from the FIFO to
microcontroller memory. The number of bytes received is available in RXBYTECNT field. Bank 1 FIFO values are read
through UDP_FDRx register. Once a transfer is done, the device firmware must release Bank 1 to the USB device by clear-
ing RX_DATA_BK1.
SAM3S Preliminary
958
6500C–ATARM–8-Feb-11