MCHC705JJ7CPE Freescale Semiconductor, MCHC705JJ7CPE Datasheet - Page 158

• Manufacturer Part Number: MCHC705JJ7CPE
• Description: IC MCU 8BIT 224 BYTES RAM 20PDIP
• Manufacturer: Freescale Semiconductor
• Series: HC05r

Specifications of MCHC705JJ7CPE

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 2.1MHz
• Connectivity: SIO
• Peripherals: POR, Temp Sensor, WDT
• Number Of I /o: 14
• Program Memory Size: 6KB (6K x 8)
• Program Memory Type: OTP
• Ram Size: 224 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-DIP (0.300", 7.62mm)
• Processor Series: HC705JJ
• Core: HC05
• Data Bus Width: 8 bit
• Data Ram Size: 224 B
• Interface Type: SIOP
• Maximum Clock Frequency: 2.1 MHz
• Number Of Programmable I/os: 14
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 4 Channel
• Package: 20PDIP
• Family Name: HC05
• Maximum Speed: 2.1 MHz
• Operating Supply Voltage: 3.3|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Mechanical Specifications
16.3 20-Pin Small Outline Integrated Circuit (Case 751D)
16.4 28-Pin Plastic Dual In-Line Package (Case 710)
158
1
20
H
28
1
D
20 PL
G
-A-
0.010 (0.25)
G
18 PL
MC68HC705JJ7 • MC68HC705JP7 Advance Information Data Sheet, Rev. 4.1
A
F
M
11
T A
10
-B-
K
C
S
D
15
14
SEATING
PLANE
P
B
-T-
10 PL
S
SEATING
PLANE
N
B
0.010 (0.25)
K
C
J
F
M
B
M
M
M
L
J
R
X 45°
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
2. DIMENSION L TO CENTER OF LEADS
3. DIMENSION B DOES NOT INCLUDE
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
G
M
NOTES:
A
B
C
D
F
H
J
K
L
N
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.150
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
(0.006) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
36.45
13.72
DIM
MIN
3.94
0.36
1.02
1.65
0.20
2.92
0.51
G
M
A
B
C
D
F
J
K
P
R
15.24 BSC
0°
2.54 BSC
MILLIMETERS
12.65
10.05
MIN
37.21
14.22
7.40
2.35
0.35
0.50
0.25
0.10
0.25
MAX
5.08
0.56
1.52
2.16
0.38
3.43
15°
1.02
1.27 BSC
0°
Freescale Semiconductor
12.95
10.55
MAX
7.60
2.65
0.49
0.90
0.32
0.25
0.75
1.435
0.540
0.155
0.014
0.040
0.065
0.008
0.115
0.020
MIN
7°
0.100 BSC
0.600 BSC
0°
INCHES
0.499
0.292
0.093
0.014
0.020
0.010
0.004
0.395
0.010
MIN
MAX
1.465
0.560
0.200
0.022
0.060
0.085
0.015
0.135
0.040
0.050 BSC
0°
15°
INCHES
MAX
0.510
0.299
0.104
0.019
0.035
0.012
0.009
0.415
0.029
7°