DF2372RVFQ34V Renesas Electronics America, DF2372RVFQ34V Datasheet - Page 1145

IC H8S/2372 MCU FLASH 144LQFP

DF2372RVFQ34V

Manufacturer Part Number
DF2372RVFQ34V
Description
IC H8S/2372 MCU FLASH 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2372RVFQ34V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
34MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
For Use With
YLCDRSK2378 - KIT DEV EVAL H8S/2378 LCDYR0K42378FC000BA - KIT EVAL FOR H8S/2378HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2372RVFQ34V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Read
Write
Note: DACK and EDACK timing: when DDS = 0 and EDDS = 0
EDACK2, EDACK3
DACK0, DACK1
φ
A23 to A0
RAS5 to RAS2
UCAS
LCAS
OE, RD
HWR
D15 to D0
OE, RD
HWR
D15 to D0
AS
RAS timing: when RAST = 0
Figure 26.14 DRAM Access Timing: Two-State Access
t
AD
Tp
t
t
AS3
PCH2
Tr
t
CSD2
t
t
t
DACD1
EDACD1
AH1
Rev.7.00 Mar. 18, 2009 page 1077 of 1136
t
t
AD
t
WRD2
WDD
Tc1
Section 26 Electrical Characteristics
t
t
AS2
AC4
t
t
OED1
WDS1
t
WCS1
t
AA3
t
t
WCH1
CASD1
t
AC1
Tc2
t
WDH2
t
t
CASW1
AH2
t
RDS2
t
WRD2
REJ09B0109-0700
t
RDH2
t
OED1
t
t
t
DACD2
EDACD2
CASD1
t
CSD3

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