DF2372RVFQ34V Renesas Electronics America, DF2372RVFQ34V Datasheet - Page 926

IC H8S/2372 MCU FLASH 144LQFP

DF2372RVFQ34V

Manufacturer Part Number
DF2372RVFQ34V
Description
IC H8S/2372 MCU FLASH 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2372RVFQ34V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
34MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
For Use With
YLCDRSK2378 - KIT DEV EVAL H8S/2378 LCDYR0K42378FC000BA - KIT EVAL FOR H8S/2378HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2372RVFQ34V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 20 Flash Memory (0.35-μm F-ZTAT Version)
Rev.7.00 Mar. 18, 2009 page 858 of 1136
REJ09B0109-0700
Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
Period during which flash memory access is prohibited
(x: Wait time after setting SWE bit)
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
φ
V
MD2 to MD0
RES
SWE bit
φ
V
MD2 to MD0
RES
SWE bit
CC
CC
2. See section 26.1.6, Flash Memory Characteristics.
3. Mode programming setup time t
power-off by pulling the pins up or down.
*
*
1
1
Figure 20.9 Power-On/Off Timing
t
OSC1
t
OSC1
t
MDS
Wait time: x
*
SWE set
Wait time: x
t
SWE set
2
MDS
*
MDS
3
*
3
(1) Boot Mode
(2) User Program Mode
(min.) = 200 ns
Programming/
erasing
possible
Programming/
erasing
possible
Wait time: 100 μs
Wait time: 100 μs
SWE cleared
SWE cleared
Min. 0 μs
Min. 0 μs

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