BGW200EG/01,515 NXP Semiconductors, BGW200EG/01,515 Datasheet - Page 3

• Manufacturer Part Number: BGW200EG/01,515
• Description: IC WLAN SIP MOD 802.11B 68HVQFN
• Manufacturer: NXP Semiconductors
• Series: BGW200r

Specifications of BGW200EG/01,515

• Frequency: 2.4GHz ~ 2.5GHz
• Modulation Or Protocol: DBPSK, DQPSK, CCK
• Applications: PDA's, Portable Audio/Video, Smartphones
• Power - Output: 8dBm ~ 18dBm
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Other names: 568-4015-2; 935279198515; BGW200EG/01-G

NXP Semiconductors
3. Applications
4. Ordering information
BGW200EG_1
Product data sheet
2.5 Software
2.6 Reference
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Table 1.
Type number
BGW200EG/01
Microcontroller firmware
IEEE 802.11b/e/i protocol firmware (see
WPA and WMM1 protocol firmware (see
Host drivers for the following operating systems:
Configuration utility
The MAC implemented in the SA2443A is fully compliant with the relevant parts of the
published IEEE 802.11 standard and further enhanced with changes detailed in the
IEEE 802.11b published amendment. The MAC has also been designed to support the
soon to be published IEEE 802.11e amendment as well as the proposed WMM1
standard. The flexible architecture should allow incorporation of any further changes to
these amendments and proposed standards before ratification and publication.
IEEE 802.11b WLAN
Smart phone or feature phone with embedded WLAN
Personal Digital Assistant (PDA) with embedded WLAN
Voice over IP (VoIP) cordless phone
Mobile gaming
N
N
WinCE 4.2/5.0
Embedded Linux
Ordering information
Package
Name
HLLGA68
Rev. 01 — 18 July 2007
Description
plastic thermal enhanced low profile land grid
array package; 68 lands; body 10
Section
Section
2.6)
2.6)
IEEE 802.11b System-in-Package
BGW200EG
15
1.3 mm
© NXP B.V. 2007. All rights reserved.
Version
SOT858-1
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