BGW200EG/01,515 NXP Semiconductors, BGW200EG/01,515 Datasheet - Page 50

• Manufacturer Part Number: BGW200EG/01,515
• Description: IC WLAN SIP MOD 802.11B 68HVQFN
• Manufacturer: NXP Semiconductors
• Series: BGW200r

Specifications of BGW200EG/01,515

• Frequency: 2.4GHz ~ 2.5GHz
• Modulation Or Protocol: DBPSK, DQPSK, CCK
• Applications: PDA's, Portable Audio/Video, Smartphones
• Power - Output: 8dBm ~ 18dBm
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Other names: 568-4015-2; 935279198515; BGW200EG/01-G

NXP Semiconductors
11. Limiting values
Table 65.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
12. Recommended operating conditions
Table 66.
[1]
BGW200EG_1
Product data sheet
Symbol
V
V
V
V
V
V
V
V
I
V
T
Symbol
V
V
V
V
V
V
V
T
latch
stg
amb
DDA(VCO)
DDA
DDD(IO)
DDD(C)
DD(PA)
DD(DRIVER)
DDA(RF)
I
esd
DDA(VCO)
DDA
DDD(IO)
DDD(C)
DD(PA)
DD(DRIVER)
DDA(RF)
JEDEC standard JESD78A, IC latch-up test.
JEDEC standard JESD22-A114-D, Electrostatic Discharge (ESD) sensitivity testing Human Body Model (HBM).
JEDEC standard JESD22-A115-A, Electrostatic Discharge (ESD) sensitivity testing Machine Model (MM).
JEDEC standard JESD22-C101C, field-induced Charged Device Model (CDM) test method for electrostatic discharge withstand
thresholds of microelectronic components.
It is possible to extend the voltage range of the baseband and radio supplies up to V
information”).
Limiting values
Recommended operating conditions
Parameter
VCO analog supply voltage
analog supply voltage
I/O digital supply voltage
core digital supply voltage
power amplifier supply voltage
driver supply voltage
RF analog supply voltage
input voltage
latch-up current
electrostatic discharge voltage
storage temperature
Parameter
VCO analog supply voltage
analog supply voltage
I/O digital supply voltage
core digital supply voltage
power amplifier supply voltage
driver supply voltage
RF analog supply voltage
ambient temperature
Rev. 01 — 18 July 2007
Conditions
V
HBM
MM
CDM
Conditions
I
< 0 V or V
I
> V
DD
DD(PA)
[1]
[2]
[3]
[4]
+ 0.6 V (see
IEEE 802.11b System-in-Package
Min
-
[1]
[1]
[1]
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
1000
200
500
55
Min
2.7
2.7
2.7
1.65
2.7
2.7
2.7
30
Section 22 “Contact
BGW200EG
Max
+3.85
+3.85
+4.6
+2.5
+3.85
+3.85
+3.85
V
100
+1000
+200
+500
+155
Typ
2.85
2.85
2.85
1.8
2.85
2.85
2.85
+25
DDD(IO)
© NXP B.V. 2007. All rights reserved.
+ 0.5
Max
3.0
3.0
3.0
1.95
3.0
3.0
3.0
+85
Unit
V
V
V
V
V
V
V
V
mA
V
V
V
C
Unit
V
V
V
V
V
V
V
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C