BGW200EG/01,515 NXP Semiconductors, BGW200EG/01,515 Datasheet - Page 61

• Manufacturer Part Number: BGW200EG/01,515
• Description: IC WLAN SIP MOD 802.11B 68HVQFN
• Manufacturer: NXP Semiconductors
• Series: BGW200r

Specifications of BGW200EG/01,515

• Frequency: 2.4GHz ~ 2.5GHz
• Modulation Or Protocol: DBPSK, DQPSK, CCK
• Applications: PDA's, Portable Audio/Video, Smartphones
• Power - Output: 8dBm ~ 18dBm
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Other names: 568-4015-2; 935279198515; BGW200EG/01-G

NXP Semiconductors
BGW200EG_1
Product data sheet
Fig 35. SPI1 slave timing (CPHA = 0)
Fig 36. SPI1 slave timing (CPHA = 1)
(CPOL = 0)
(CPOL = 1)
(CPOL = 0)
(CPOL = 1)
SPI_SS_N
SPI_MOSI
SPI_MISO
SPI_SS_N
SPI_MOSI
SPI_MISO
SPI_SCK
SPI_SCK
SPI_SCK
SPI_SCK
(output)
(output)
(input)
(input)
t
en(o)(SPI_MISO)
t
en(o)(SPI_MISO)
t
t
su(SPI_SS_N)
su(SPI_SS_N)
Rev. 01 — 18 July 2007
t
su(SPI_MOSI)
T
T
t
d(o)(SPI_MISO)
SPI_SCK
SPI_SCK
t
d(o)(SPI_MISO)
t
su(SPI_MOSI)
t
t
h(o)(SPI_MISO)
h(i)(SPI_MOSI)
IEEE 802.11b System-in-Package
t
h(o)(SPI_MISO)
t
h(i)(SPI_MOSI)
BGW200EG
t
t
dis(o)(SPI_MISO)
dis(o)(SPI_MISO)
t
t
h(SPI_SS_N)
h(SPI_SS_N)
© NXP B.V. 2007. All rights reserved.
001aad228
001aad227
61 of 76